M2GL025T-1FG484I

IC FPGA 267 I/O 484FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 267 1130496 27696 484-BGA

Quantity 490 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O267Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs27696Number of Logic Elements/Cells27696
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1130496

Overview of M2GL025T-1FG484I – IGLOO2 FPGA, 27,696 logic elements, 484-BGA

The M2GL025T-1FG484I is an IGLOO2 field programmable gate array (FPGA) from Microchip Technology featuring flash-based FPGA fabric and integrated high-performance communications and memory interfaces. This device targets industrial embedded applications that require moderate logic density, on-chip memory, DSP capabilities and multi-standard high-speed I/O.

Its architecture combines 27,696 logic elements with approximately 1.13 Mbits of on-chip RAM, multiple SERDES lanes and DDRx memory controller support to enable communications, signal processing and memory-interface functions in a surface-mount 484-BGA package.

Key Features

  • Core Logic  27,696 logic elements providing the programmable fabric capacity for control, glue logic and moderate-scale custom logic implementations.
  • Flash-Based Fabric  Fourth-generation flash-based FPGA fabric for nonvolatile configuration and inherent retention of programmed designs.
  • Embedded Memory  Approximately 1.13 Mbits of on-chip RAM plus architecture-level support for multiple embedded SRAM blocks and eNVM options described in the IGLOO2 family.
  • DSP and Mathblocks  Family architecture includes dedicated mathblock resources for signed/unsigned multiplication and accumulation to accelerate digital signal processing tasks.
  • High-Speed Serial Interfaces  SERDES capabilities (family support up to 16 lanes) and protocol support such as PCIe and XAUI/XGXS for high-bandwidth serial connectivity.
  • High-Speed Memory Interfaces  Support for DDRx memory controllers (LPDDR/DDR2/DDR3) with family-level max clock rates noted at up to 333 MHz and flexible DRAM bus widths.
  • Clocking Resources  Multiple clock sources and up to 8 Clock Conditioning Circuits (CCCs) with integrated PLLs for flexible frequency generation and phase control (family-level capabilities).
  • Power and I/O Voltage  Wide supply range noted for the device from 1.14 V to 2.625 V and multi-standard I/O support across common logic and DDR standards (family-level MSIO options).
  • Package and Thermal  Surface-mount 484-FPBGA (23 × 23 mm) package; industrial-grade device with operating temperature range of −40 °C to 100 °C.
  • Standards and Security  IGLOO2 family-level security and data-protection features including encrypted bitstream options and anti-tamper mechanisms (as described in family documentation).
  • Compliance  RoHS compliant.

Typical Applications

  • Industrial Networking  Implements protocol handling, packet buffering and SERDES-based PHY interfaces for industrial switches, media converters and network bridges.
  • High-Speed Communications  Supports PCIe endpoints, XAUI/10Gb Ethernet PHY interfaces and serialized links for networking equipment and high-throughput I/O modules.
  • Embedded Signal Processing  Leverages on-chip RAM and mathblock DSP resources for sensor processing, filtering and real-time data handling in instrumentation and control systems.
  • Memory Interface & Bridging  Uses integrated DDRx controllers and memory subsystem features for high-speed buffering, DDR bridging and system memory expansion tasks.

Unique Advantages

  • Integrated, Flash-Based Configuration: Flash-based FPGA fabric provides nonvolatile configuration so designs remain programmed without external configuration memory.
  • Balanced Logic and Memory: 27,696 logic elements combined with approximately 1.13 Mbits of embedded RAM allow compact implementations of control, buffering and moderate DSP functions.
  • High-Speed I/O Capability: SERDES lanes and PCIe/10Gb-capable interfaces enable direct implementation of serial communication links without extensive external PHYs.
  • Flexible Memory Subsystem: On-chip memory plus DDRx controller support (family-level) simplifies high-bandwidth data paths and reduces external component count for memory interfaces.
  • Industrial Temperature Range: Rated for −40 °C to 100 °C operation to meet temperature demands of industrial embedded deployments.
  • Wide Supply Voltage Range: Operating supply range from 1.14 V to 2.625 V supports integration into a variety of system power domains.

Why Choose M2GL025T-1FG484I?

The M2GL025T-1FG484I delivers a practical balance of programmable logic density, on-chip memory and high-speed serial/memory interfaces in a single industrial-grade 484-BGA package. It is suited for embedded designs that need moderate logic capacity combined with SERDES links, DDRx memory support and DSP acceleration without adding extensive external components.

Backed by Microchip Technology’s IGLOO2 family architecture, the device provides configurable clocking, security features and a range of interface options that help ensure long-term scalability and robust operation in industrial applications. RoHS compliance and surface-mount packaging support standard assembly flows.

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