M2GL025T-1FCS325I

The M2GL025T-1FCS325I is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for industrial applications. It integrates a mid-density programmable fabric with 27,696 logic elements and approximately 1.13 Mbits of embedded memory to support a range of embedded logic tasks.

With 180 I/Os, a compact 325-TFBGA/325-FCBGA (11×11) package and a wide supply voltage range, this device targets designs that require configurable logic, moderate on-chip RAM and industrial-temperature operation.

Key Features

• Logic Capacity  Provides 27,696 logic elements suitable for mid-density implementation of custom logic, glue-logic and control functions.
• Embedded Memory  Approximately 1.13 Mbits of on-chip RAM to support data buffering, state machines and local storage without external memory.
• I/O  180 general-purpose I/Os to accommodate multiple parallel interfaces, sensor connections and control signals.
• Power  Operates across a wide supply range from 1.14 V to 2.625 V, allowing flexible integration with different power rails.
• Package and Mounting  Available in a 325-TFBGA / 325-FCBGA (11×11) package with surface-mount mounting for compact board layouts.
• Temperature Grade  Industrial operating range from -40°C to 100°C for deployment in harsher environments.
• Compliance  RoHS compliant to meet standard environmental requirements.

Typical Applications

• Industrial control  Use the device to implement custom control logic, I/O aggregation and protocol interfacing in industrial automation systems where industrial temperature range is required.
• Embedded system glue logic  Deploy as a reprogrammable glue-logic element to consolidate discrete components and simplify board designs.
• Sensor interfacing and data aggregation  Leverage the 180 I/Os and embedded memory to collect, buffer and preprocess sensor data at the edge.

Unique Advantages

• Highly configurable logic capacity: 27,696 logic elements enable flexible implementation of custom state machines and control functions without external ASICs.
• On-chip memory reduces BOM: Approximately 1.13 Mbits of embedded RAM lowers reliance on external memory devices for buffering and temporary storage.
• Flexible I/O count: 180 I/Os support multiple parallel interfaces and expandability for diverse peripheral connections.
• Wide supply voltage support: 1.14 V to 2.625 V operation simplifies integration with existing power architectures.
• Industrial temperature qualification: Rated from -40°C to 100°C for deployment in environments that demand broader temperature tolerance.
• Compact surface-mount package: 325-TFBGA / 325-FCBGA (11×11) packaging helps conserve PCB area in space-constrained designs.

Why Choose M2GL025T-1FCS325I?

The M2GL025T-1FCS325I balances a mid-range logic capacity with substantial embedded memory and a high I/O count in a compact surface-mount BGA package. Its supply voltage flexibility and industrial temperature rating make it suitable for systems that require dependable programmable logic across varied operating conditions.

This FPGA is a strong fit for design teams seeking a reprogrammable, integrated solution to consolidate logic, reduce external components and accelerate time-to-market while maintaining design flexibility and industrial robustness.

Request a quote or contact sales to discuss pricing, availability and how the M2GL025T-1FCS325I can be integrated into your next design.