M2GL025TS-FCS325

The M2GL025TS-FCS325 is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology. It provides a configured logic fabric with 27,696 logic elements and approximately 1.13 Mbits of embedded memory, combined with 180 user I/O pins in a compact BGA package.

Designed as a flexible, surface-mount FPGA solution, the device operates over a supply range of 1.14 V to 2.625 V and is specified for commercial temperature operation from 0 °C to 85 °C. Its feature set supports on-chip logic, memory, and I/O consolidation for a range of electronic designs.

Key Features

• Logic Capacity  27,696 logic elements provide substantial programmable logic resources for custom digital functions.
• Embedded Memory  Approximately 1.13 Mbits of on-chip RAM to support data buffering, state machines, and local storage.
• I/O Count  180 user I/O pins enabling broad connectivity to external peripherals, sensors, and subsystems.
• Power Supply Range  Operates from 1.14 V to 2.625 V, accommodating a range of core and I/O voltage requirements.
• Package and Mounting  Available in a 325-pin TFBGA/FCBGA package (325-FCBGA, 11 × 11), optimized for surface-mount assembly.
• Operating Grade  Commercial-grade device qualified for 0 °C to 85 °C ambient operation.
• Environmental Compliance  RoHS-compliant construction for regulatory alignment in many production environments.

Typical Applications

• Custom Digital Logic  Implement application-specific logic, state machines, and data processing using the device's 27,696 logic elements and embedded RAM.
• I/O Consolidation  Use the 180 available I/O pins to aggregate and interface multiple peripheral signals on a single programmable device.
• Embedded System Glue Logic  Replace discrete glue components with programmable fabric to simplify board design and consolidate functions.

Unique Advantages

• High Logic Density: The large number of logic elements enables complex logic implementations without external ASICs or multiple FPGAs.
• On-Chip Memory: Approximately 1.13 Mbits of embedded RAM reduces reliance on external memory for buffering and local storage.
• Significant I/O Resource: 180 I/O pins provide flexibility for connecting to a variety of peripherals and interfaces.
• Compact BGA Packaging: The 325-TFBGA/FCBGA (11 × 11) package supports high-density PCB layouts while maintaining surface-mount compatibility.
• Wide Supply Range: Operation from 1.14 V to 2.625 V offers adaptability across different voltage domains.
• Commercial Temperature Rating: Rated for 0 °C to 85 °C, suitable for standard commercial applications and environments.

Why Choose M2GL025TS-FCS325?

The M2GL025TS-FCS325 positions itself as a capable IGLOO2 FPGA option for designs that require substantial on-chip logic, embedded memory, and a high I/O count within a compact BGA footprint. Backed by Microchip Technology, this device is a practical choice for engineers seeking programmable flexibility combined with clear electrical and thermal operating parameters.

Its combination of logic capacity, approximately 1.13 Mbits of embedded RAM, and 180 I/O pins makes it suitable for consolidating digital functions and simplifying board-level designs, offering long-term value through scalable programmable resources and RoHS compliance.

Request a quote or submit an inquiry to our sales team to learn more about availability and pricing for the M2GL025TS-FCS325.