M2GL025TS-FCSG325

The M2GL025TS-FCSG325 is an IGLOO2 field programmable gate array (FPGA) IC supplied in a 325‑TFBGA (325‑FCBGA) package. It provides a programmable logic fabric with a significant number of logic elements, embedded RAM, and a comprehensive I/O count for configurable digital designs.

With a commercial operating temperature range and a supply voltage window from 1.14 V to 2.625 V, this device is targeted at embedded applications that require flexible logic resources, on‑chip memory, and a compact surface‑mount package.

Key Features

• Logic Capacity  Provides 27,696 logic elements to implement complex custom logic, state machines, and glue‑logic functions.
• Embedded Memory  Approximately 1.13 Mbits of on‑chip RAM for FIFOs, buffers, and small data storage without external memory devices.
• I/O Resources  180 I/O pins suitable for interfacing with peripherals, sensors, and other digital subsystems.
• Power and Supply Range  Operates from 1.14 V to 2.625 V, enabling integration into systems with varied supply domains.
• Package and Mounting  Supplied in a 325‑TFBGA / 325‑FCBGA (11×11) surface‑mount package for compact board implementations.
• Operating Temperature  Commercial grade operation from 0 °C to 85 °C for standard embedded and commercial applications.
• RoHS Compliant  Conforms to RoHS requirements for reduced hazardous substances in manufacturing.

Typical Applications

• Embedded Systems  Use configurable logic and on‑chip memory to implement custom control, glue logic, and protocol handling within compact embedded designs.
• Communications Interfaces  Leverage the available I/O and programmable fabric to implement serial interfaces, protocol bridging, and timing control functions.
• Consumer and Commercial Electronics  Integrate programmable logic for feature customization, peripheral aggregation, and system control within commercial temperature environments.

Unique Advantages

• Generous Logic Density:  27,696 logic elements allow substantial on‑chip implementation of custom logic without immediate need for external support devices.
• On‑Chip Memory:  Approximately 1.13 Mbits of embedded RAM reduce dependence on external memory for buffering and temporary storage, simplifying BOM.
• High I/O Count:  180 I/O pins provide flexibility for connecting multiple peripherals and interfaces directly to the FPGA fabric.
• Flexible Supply Range:  Support for 1.14 V to 2.625 V supplies accommodates a variety of system voltage domains and design choices.
• Compact Surface‑Mount Package:  325‑TFBGA / 325‑FCBGA (11×11) package enables space‑efficient board layouts for compact systems.
• RoHS Compliance:  Meets environmental requirements for lead‑free manufacturing processes.

Why Choose M2GL025TS-FCSG325?

The M2GL025TS-FCSG325 combines a substantial logic element count, meaningful on‑chip RAM, and a broad I/O complement in a compact surface‑mount BGA package. Its supply voltage flexibility and commercial temperature rating make it suitable for a wide range of embedded and commercial designs that require programmable logic and local memory resources.

This part is a practical choice for engineering teams seeking a balance of integration, I/O capability, and package density while maintaining RoHS compliance and predictable commercial‑grade operation. It supports rapid prototyping and production designs that need configurable logic without excessive external components.

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