M2GL025TS-FCS325I
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 180 1130496 27696 325-TFBGA, FCBGA |
|---|---|
| Quantity | 398 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 325-FCBGA (11x11) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 325-TFBGA, FCBGA | Number of I/O | 180 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 27696 | Number of Logic Elements/Cells | 27696 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1130496 |
Overview of M2GL025TS-FCS325I – IGLOO2 FPGA, 180 I/O, 325‑TFBGA
The M2GL025TS-FCS325I is an IGLOO2 Field Programmable Gate Array (FPGA) IC designed for industrial applications. It combines 27,696 logic elements with approximately 1.13 Mbits of embedded memory and 180 I/O in a compact 325-TFBGA / 325-FCBGA (11×11) package.
With a wide supply range of 1.14 V to 2.625 V and an operating temperature rating from −40 °C to 100 °C, this device targets embedded and industrial designs that require substantial logic density, on-chip memory, and robust environmental tolerance.
Key Features
- Logic Capacity 27,696 logic elements for implementing complex custom logic, state machines, and control functions.
- Embedded Memory Approximately 1.13 Mbits of on-chip RAM to support buffering, lookup tables, and local data storage without external memory.
- I/O Count 180 I/O pins to interface with sensors, peripherals, mezzanine modules, or external devices.
- Power Supply Range Operates across a 1.14 V to 2.625 V supply range to accommodate various core and I/O voltage requirements.
- Package and Mounting Available in a 325-TFBGA / 325-FCBGA (11×11) package for surface-mount applications requiring a compact footprint.
- Industrial Temperature Grade Rated for −40 °C to 100 °C operation for use in industrial environments.
- RoHS Compliance RoHS compliant for environmental and manufacturing compatibility.
Typical Applications
- Industrial Control Systems Use the industrial temperature rating and 180 I/O to implement control logic, I/O aggregation, and deterministic state machines in factory or field equipment.
- Communication and Protocol Bridging Leverage 27,696 logic elements and plentiful I/O to implement protocol translation, custom packet handling, or interface logic.
- Embedded Signal Processing On-chip memory and dense logic resources support buffering and localized data processing for embedded signal conditioning or pre-processing tasks.
- Custom Logic and Prototyping Compact 325‑TFBGA package and surface-mount mounting suit board-level integration for custom logic implementations and development platforms.
Unique Advantages
- Substantial Logic Density: 27,696 logic elements provide headroom for medium-to-large custom logic designs without immediate need for external acceleration.
- Embedded Memory Availability: Approximately 1.13 Mbits of on-chip RAM reduces reliance on external memory for many buffering and LUT requirements.
- High I/O Count: 180 I/O pins enable direct interfacing to multiple peripherals and sensors, simplifying board-level routing.
- Industrial-Grade Operation: Rated from −40 °C to 100 °C, suitable for deployment in challenging environmental conditions.
- Flexible Power Range: Support for 1.14 V to 2.625 V supply voltages provides design flexibility across core and I/O voltage domains.
- Compact Surface-Mount Package: 325‑TFBGA / 325‑FCBGA (11×11) packaging balances density and manufacturability for space-constrained designs.
Why Choose M2GL025TS-FCS325I?
The M2GL025TS-FCS325I IGLOO2 FPGA delivers a balanced combination of logic capacity, embedded memory, and I/O resources in an industrial-grade, surface-mount package. Its specification set—27,696 logic elements, approximately 1.13 Mbits of on-chip RAM, 180 I/O, and operation from −40 °C to 100 °C—addresses embedded and industrial designs that require reliable, board-level programmable logic with significant local memory.
This device is well suited for engineers and system designers who need a compact FPGA solution with a broad supply voltage range and robust environmental tolerance, enabling integration into a wide range of industrial and embedded products while keeping BOM complexity manageable.
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