M2GL050-1FGG896I

IC FPGA 377 I/O 896FBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 377 1869824 56340 896-BGA

Quantity 1,086 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package896-FBGA (31x31)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case896-BGANumber of I/O377Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56340Number of Logic Elements/Cells56340
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits1869824

Overview of M2GL050-1FGG896I – IGLOO2 FPGA, 377 I/Os, 896‑BGA

The M2GL050-1FGG896I is a flash-based IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology. It combines fourth-generation flash FPGA fabric with integrated high-performance communications and memory interfaces to address embedded and industrial applications that require secure, low-power programmable logic.

Built on the IGLOO2 architecture, this device targets designs that need a balance of logic density, embedded memory, DSP capability and multi-standard I/O connectivity while operating across an industrial temperature range.

Key Features

  • Core Architecture  Efficient 4-input look-up table (LUT) fabric with carry chains for higher-performance logic implementation.
  • Logic Resources  Approximately 56,340 logic elements to implement complex custom logic and control functions.
  • Embedded Memory  Approximately 1.87 Mbits of total on-chip RAM, plus 64 KB of eSRAM and up to 512 KB of embedded nonvolatile memory (eNVM) for configuration and data storage.
  • DSP / Mathblocks  IGLOO2 family includes mathblocks for DSP workloads, supporting signed and unsigned multipliers and wide accumulators for signal-processing tasks.
  • High-Speed Serial Interfaces  Family-level support for up to 16 SERDES lanes and PCI Express endpoint cores (x1/x2/x4) enabling high-throughput serial connectivity and protocol implementations.
  • High-Speed Memory Controllers  IGLOO2 architecture supports up to two DDRx memory controllers (LPDDR/DDR2/DDR3) for high-speed external memory interfaces and efficient data buffering.
  • Clocking Resources  Multiple on-chip oscillators and up to eight Clock Conditioning Circuits (CCCs) with integrated PLLs for flexible clock generation and distribution.
  • Security Features  Design and data security capabilities in the IGLOO2 family include encrypted bitstream loading and cryptographic services such as AES-256 and SHA-256 along with device anti-tamper and zeroization features.
  • Package, I/O and Power  896‑FBGA (31×31) surface-mount package with 377 user I/Os. Supported supply voltage range is 1.14 V to 2.625 V.
  • Industrial Grade and Environmental  Specified operating temperature range of −40 °C to 100 °C and RoHS compliance for regulated-environment deployments.

Typical Applications

  • High‑Speed Communications  Implement serial protocols and PHY interfaces using integrated SERDES lanes and PCIe cores for networking equipment and link aggregation.
  • Memory Interface and Buffering  Use built-in DDRx controllers and on-chip memory to manage external DRAM access and data buffering in systems with high bandwidth demands.
  • DSP and Signal Processing  Leverage mathblocks and embedded RAM for hardware acceleration of filtering, packet processing, and real‑time signal tasks.
  • Industrial Control and Embedded Systems  Industrial temperature rating, broad I/O standards and flexible voltage support suit factory automation, instrumentation and embedded controller designs.

Unique Advantages

  • Highly integrated architecture:  Combines logic, embedded SRAM/eNVM and memory controllers to reduce board-level component count and simplify system design.
  • Flexible I/O and serial connectivity:  Hundreds of user I/Os plus multi‑lane SERDES and PCIe support enable a wide range of interface implementations without external bridging devices.
  • On-chip memory and DSP support:  Substantial embedded RAM and DSP mathblocks accelerate data‑intensive and signal processing workloads while minimizing external memory dependence.
  • Security and supply-chain features:  Encrypted bitstream options and device-level anti‑tamper capabilities help protect IP and fielded systems.
  • Industrial readiness:  Wide operating temperature range and surface-mount 896‑FBGA packaging meet industrial deployment requirements.
  • RoHS compliant:  Meets environmental compliance expectations for modern electronics manufacturing.

Why Choose M2GL050-1FGG896I?

The M2GL050-1FGG896I delivers a balanced combination of logic density, embedded memory and high‑speed I/O suitable for industrial and embedded designs that require configurable hardware acceleration, secure bitstream handling, and flexible memory interfaces. Its IGLOO2 flash‑based architecture and integrated communications capabilities help reduce external components and simplify system partitioning.

This device is a fit for engineers and OEMs building robust, industrial-temperature systems that need scalable programmable logic with on-chip resources for data buffering, DSP acceleration and secure deployment. Backed by Microchip Technology’s IGLOO2 architecture, it provides a platform-level feature set for long‑lifecycle embedded designs.

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