M2GL050T-FCS325

IC FPGA 200 I/O 325BGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 200 1869824 56340 325-TFBGA, FCBGA

Quantity 849 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package325-FCBGA (11x11)GradeCommercialOperating Temperature0°C – 85°C
Package / Case325-TFBGA, FCBGANumber of I/O200Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56340Number of Logic Elements/Cells56340
Number of GatesN/AECCN3A991B2HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1869824

Overview of M2GL050T-FCS325 – IGLOO2 Field Programmable Gate Array, 325-TFBGA (200 I/Os)

The M2GL050T-FCS325 is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a balanced combination of logic capacity, embedded memory, and I/O density in a compact 325-FCBGA package for commercial-grade designs.

Configured for surface-mount assembly, this device supports a wide supply voltage range and standard commercial operating temperatures, making it suitable for a variety of programmable-logic applications where on-chip resources and package density are important considerations.

Key Features

  • Logic Capacity  Approximately 56,340 logic elements (LEs) to implement custom digital functions and state machines.
  • On-Chip Memory  Approximately 1.87 Mbits of embedded memory (total RAM bits: 1,869,824) for data buffering, FIFOs, and register files.
  • I/O Density  200 available I/Os to support multiple external interfaces and mixed-signal connectivity.
  • Power Supply Range  Flexible core and I/O support with a supply voltage range of 1.14 V to 2.625 V to accommodate different system voltage domains.
  • Package & Mounting  325-TFBGA (325-FCBGA, 11×11) surface-mount package for compact board integration and high pin density.
  • Temperature & Grade  Commercial-grade device rated for 0 °C to 85 °C operation.
  • Regulatory Compliance  RoHS-compliant construction for environmentally conscious designs.

Unique Advantages

  • Substantial Logic Resource: 56,340 logic elements provide room for complex combinational and sequential logic without external glue logic.
  • Built-in Memory Capacity: Approximately 1.87 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage tasks.
  • High I/O Count: 200 I/Os enable simultaneous connections to peripherals, sensors, and external controllers.
  • Flexible Power Options: Support for supply voltages from 1.14 V to 2.625 V allows integration into systems with varying voltage domains.
  • Compact, High-Density Package: The 325-FCBGA (11×11) package offers a small footprint for space-constrained PCBs while preserving pin count.
  • Commercial Temperature Range: Rated for 0 °C to 85 °C operation to match typical commercial deployments.

Why Choose M2GL050T-FCS325?

The M2GL050T-FCS325 combines a sizable logic element count, substantial embedded memory, and a 200-pin I/O complement in a compact 325-FCBGA surface-mount package. Its broad supply voltage range and commercial operating temperature make it a practical choice for designs that require flexible power integration and on-chip resources without adding external components.

This IGLOO2 FPGA is well suited to teams looking to consolidate logic, reduce board-level BOM, and maintain a compact PCB profile while ensuring RoHS compliance and standard commercial temperature operation.

Request a quote or submit an inquiry to evaluate the M2GL050T-FCS325 for your next programmable-logic design.

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