M2GL050T-FCS325
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 200 1869824 56340 325-TFBGA, FCBGA |
|---|---|
| Quantity | 849 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 325-FCBGA (11x11) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 325-TFBGA, FCBGA | Number of I/O | 200 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56340 | Number of Logic Elements/Cells | 56340 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1869824 |
Overview of M2GL050T-FCS325 – IGLOO2 Field Programmable Gate Array, 325-TFBGA (200 I/Os)
The M2GL050T-FCS325 is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a balanced combination of logic capacity, embedded memory, and I/O density in a compact 325-FCBGA package for commercial-grade designs.
Configured for surface-mount assembly, this device supports a wide supply voltage range and standard commercial operating temperatures, making it suitable for a variety of programmable-logic applications where on-chip resources and package density are important considerations.
Key Features
- Logic Capacity Approximately 56,340 logic elements (LEs) to implement custom digital functions and state machines.
- On-Chip Memory Approximately 1.87 Mbits of embedded memory (total RAM bits: 1,869,824) for data buffering, FIFOs, and register files.
- I/O Density 200 available I/Os to support multiple external interfaces and mixed-signal connectivity.
- Power Supply Range Flexible core and I/O support with a supply voltage range of 1.14 V to 2.625 V to accommodate different system voltage domains.
- Package & Mounting 325-TFBGA (325-FCBGA, 11×11) surface-mount package for compact board integration and high pin density.
- Temperature & Grade Commercial-grade device rated for 0 °C to 85 °C operation.
- Regulatory Compliance RoHS-compliant construction for environmentally conscious designs.
Unique Advantages
- Substantial Logic Resource: 56,340 logic elements provide room for complex combinational and sequential logic without external glue logic.
- Built-in Memory Capacity: Approximately 1.87 Mbits of on-chip RAM reduces dependence on external memory for many buffering and storage tasks.
- High I/O Count: 200 I/Os enable simultaneous connections to peripherals, sensors, and external controllers.
- Flexible Power Options: Support for supply voltages from 1.14 V to 2.625 V allows integration into systems with varying voltage domains.
- Compact, High-Density Package: The 325-FCBGA (11×11) package offers a small footprint for space-constrained PCBs while preserving pin count.
- Commercial Temperature Range: Rated for 0 °C to 85 °C operation to match typical commercial deployments.
Why Choose M2GL050T-FCS325?
The M2GL050T-FCS325 combines a sizable logic element count, substantial embedded memory, and a 200-pin I/O complement in a compact 325-FCBGA surface-mount package. Its broad supply voltage range and commercial operating temperature make it a practical choice for designs that require flexible power integration and on-chip resources without adding external components.
This IGLOO2 FPGA is well suited to teams looking to consolidate logic, reduce board-level BOM, and maintain a compact PCB profile while ensuring RoHS compliance and standard commercial temperature operation.
Request a quote or submit an inquiry to evaluate the M2GL050T-FCS325 for your next programmable-logic design.

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