M2GL050T-FCS325I

The M2GL050T-FCS325I is an IGLOO2 field programmable gate array (FPGA) in a 325-TFBGA / 325-FCBGA (11×11) surface-mount package. It provides reconfigurable logic resources, a large complement of I/Os and on-chip RAM for industrial applications that require configurable digital logic within a robust operating range.

With 56,340 logic elements, approximately 1.87 Mbits of embedded memory and up to 200 I/Os, this device targets designs that need significant programmable logic capacity combined with broad I/O connectivity and industrial-temperature operation.

Key Features

• Logic Capacity — 56,340 logic elements for implementing custom digital functions and complex state machines.
• Embedded Memory — Approximately 1.87 Mbits of on-chip RAM to support buffering, FIFOs and local data storage without external memory.
• I/O Count — Up to 200 general-purpose I/Os to interface with peripherals, sensors and external subsystems.
• Power Supply — Supported voltage range from 1.14 V to 2.625 V to accommodate a variety of core and I/O power schemes.
• Package & Mounting — 325-TFBGA / 325-FCBGA (11×11) surface-mount package suitable for compact board-level integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• RoHS Compliant — Conforms to RoHS requirements for reduced hazardous substances.

Typical Applications

• Industrial Control — Implement custom control logic and real-time processing in industrial systems, leveraging the device’s logic density and industrial temperature rating.
• Embedded Systems — Provide programmable glue logic, protocol handling and local buffering using on-chip memory and 200 I/Os.
• Communications and Interfaces — Support custom interface bridging and protocol conversion tasks with abundant I/O and embedded RAM.

Unique Advantages

• High Logic Density: 56,340 logic elements enable compact implementation of complex digital functions without multiple devices.
• On-Chip Memory: Approximately 1.87 Mbits of embedded RAM reduces dependence on external memory, simplifying board design.
• Generous I/O Capacity: 200 I/Os give flexibility for interfacing to numerous peripherals and subsystems directly.
• Wide Supply Range: 1.14 V to 2.625 V support allows integration into varied power architectures.
• Industrial Qualification: Operation from −40 °C to 100 °C supports deployment in demanding temperature environments.
• RoHS Compliant: Meets environmental requirements for reduced hazardous substance content.

Why Choose M2GL050T-FCS325I?

The M2GL050T-FCS325I combines a substantial logic fabric with embedded memory and a high I/O count in a compact 325-ball BGA package, making it suitable for designers who need reconfigurable logic capacity in industrial environments. Its voltage flexibility and RoHS compliance simplify integration into modern hardware platforms.

This device is well suited for teams building industrial control, embedded processing and interface-rich systems that require scalable programmable logic, robust thermal performance and compact board-level packaging.

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