M2GL050TS-FCSG325

IC FPGA 200 I/O 324CSBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 200 1869824 56340 325-TFBGA, FCBGA

Quantity 7 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package325-FCBGA (11x11)GradeCommercialOperating Temperature0°C – 85°C
Package / Case325-TFBGA, FCBGANumber of I/O200Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56340Number of Logic Elements/Cells56340
Number of GatesN/AECCN3A991B2HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1869824

Overview of M2GL050TS-FCSG325 – IGLOO2 FPGA, 200 I/Os, 325-TFBGA

The M2GL050TS-FCSG325 is a Field Programmable Gate Array (FPGA) IC from the IGLOO2 family. It provides a balance of logic capacity, embedded memory, and I/O count in a compact 325-ball FCBGA package for commercial-grade programmable logic designs.

Resources on-chip include 56,340 logic elements and approximately 1.87 Mbits of embedded memory, with flexible supply-voltage support and a surface-mount 325-FCBGA (11×11) package.

Key Features

  • Core Logic 56,340 logic elements suitable for mid-range programmable logic implementations.
  • Embedded Memory Approximately 1.87 Mbits of on-chip RAM for data buffering, state storage, and lookup tables.
  • I/O Count 200 user I/Os to support multiple external interfaces and peripheral connections.
  • Power and Voltage Wide supply-voltage range from 1.14 V to 2.625 V to accommodate different I/O standards and power domains.
  • Package and Mounting 325-TFBGA / 325-FCBGA footprint (supplier package: 325-FCBGA, 11×11) optimized for surface-mount PCB assembly.
  • Operating Range Commercial operating temperature range of 0 °C to 85 °C for standard application environments.
  • Compliance RoHS compliant to support environmentally conscious designs and manufacturing requirements.

Unique Advantages

  • High logic capacity: 56,340 logic elements enable substantial on-chip logic integration, reducing the need for external glue logic.
  • Significant on-chip RAM: Approximately 1.87 Mbits of embedded memory supports complex buffering and stateful functions inside the FPGA fabric.
  • Generous I/O resources: 200 I/Os provide flexibility for multi-interface designs and parallel peripheral connections.
  • Flexible supply-voltage range: 1.14 V to 2.625 V allows integration into a variety of power architectures and I/O standards.
  • Compact surface-mount package: 325-FCBGA (11×11) offers a space-efficient footprint for dense PCB layouts.
  • Commercial-grade suitability: Specified 0 °C to 85 °C operating range matches typical consumer and industrial-adjacent applications.

Why Choose M2GL050TS-FCSG325?

The M2GL050TS-FCSG325 positions itself as a solid mid-range FPGA option, combining 56,340 logic elements, approximately 1.87 Mbits of embedded RAM, and 200 I/Os in a compact 325-FCBGA package. Its wide supply-voltage range and RoHS compliance make it adaptable for a variety of commercial designs where on-chip logic density and I/O flexibility matter.

This device is well suited to engineers and procurement teams designing systems that require a balance of logic resources, embedded memory, and a high I/O count in a surface-mount package. Its specification set supports scalable designs that demand reliable, verifiable FPGA resources within a commercial temperature envelope.

Request a quote or submit an inquiry for pricing and availability of the M2GL050TS-FCSG325.

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