M2GL050TS-FCSG325I
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 200 1869824 56340 325-TFBGA, FCBGA |
|---|---|
| Quantity | 764 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 325-FCBGA (11x11) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 325-TFBGA, FCBGA | Number of I/O | 200 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56340 | Number of Logic Elements/Cells | 56340 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1869824 |
Overview of M2GL050TS-FCSG325I – IGLOO2 FPGA, 56,340 Logic Elements, 325-TFBGA
The M2GL050TS-FCSG325I is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a high density of programmable logic and on-chip RAM in a compact 325-TFBGA (11×11) package for industrial applications.
With 56,340 logic elements, approximately 1.87 Mbits of embedded memory, 200 user I/Os, and a broad supply and temperature range, this device supports flexible power envelopes and reliable operation across industrial environments.
Key Features
- Core Logic Approximately 56,340 logic elements provide substantial programmable fabric for complex digital functions and custom logic implementations.
- Embedded Memory Approximately 1.87 Mbits of on-chip RAM for buffering, temporary storage, and data processing local to the fabric.
- I/O 200 user I/Os to support a wide range of peripheral interfaces and I/O connectivity requirements.
- Power Supply Range Operates across a supply range of 1.14 V to 2.625 V, enabling flexible power-design choices.
- Package and Mounting 325-TFBGA (11×11) package in a surface-mount form factor for compact board-level integration.
- Industrial Temperature Grade Rated for operation from −40°C to 100°C to accommodate industrial temperature environments.
- Regulatory RoHS compliant.
Typical Applications
- Industrial Control Use the device for programmable logic in automation systems where industrial temperature range and high I/O count are required.
- Embedded Processing Implement custom data paths and control logic leveraging the device’s large logic element count and on-chip RAM.
- Communication Interfaces Support protocol bridging and I/O aggregation using the 200 available user I/Os for diverse interface requirements.
- Instrumentation and Measurement Deploy in test and measurement equipment that benefits from local memory and dense programmable logic in a compact package.
Unique Advantages
- High Logic Density: 56,340 logic elements enable implementation of complex custom logic and multiple functions on a single device, reducing board-level BOM.
- Significant On-Chip Memory: Approximately 1.87 Mbits of embedded RAM reduces reliance on external memory for buffering and accelerates local data handling.
- Generous I/O Capacity: 200 user I/Os provide flexibility to connect sensors, actuators, and communication peripherals without extensive external multiplexing.
- Wide Voltage Flexibility: 1.14 V to 2.625 V supply range supports a variety of power-architecture choices and can help optimize overall system power.
- Industrial Temperature Range: −40°C to 100°C rating supports deployment in harsher thermal environments common to industrial systems.
- Compact Surface-Mount Package: 325-TFBGA (11×11) footprint enables space-efficient PCB designs while retaining high integration.
Why Choose M2GL050TS-FCSG325I?
The M2GL050TS-FCSG325I positions itself as a robust, high-density FPGA option for industrial designs that require substantial programmable logic, embedded memory, and flexible I/O. Its combination of logic capacity, on-chip RAM, and wide operating conditions makes it suitable for embedded processing, control, and interface tasks where reliability and integration are key.
Manufactured by Microchip Technology and offered in a compact 325-TFBGA surface-mount package with RoHS compliance, this device provides a balanced platform for engineers seeking to consolidate functions, reduce external components, and maintain operation across industrial temperature ranges.
Request a quote or submit an inquiry to purchase the M2GL050TS-FCSG325I and evaluate how its logic density, memory, and I/O capabilities can fit your next industrial design.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
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