M2GL050TS-FCSG325I

IC FPGA 200 I/O 324CSBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 200 1869824 56340 325-TFBGA, FCBGA

Quantity 764 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package325-FCBGA (11x11)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case325-TFBGA, FCBGANumber of I/O200Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56340Number of Logic Elements/Cells56340
Number of GatesN/AECCN3A991B2HTS Code8542.39.0001
QualificationN/ATotal RAM Bits1869824

Overview of M2GL050TS-FCSG325I – IGLOO2 FPGA, 56,340 Logic Elements, 325-TFBGA

The M2GL050TS-FCSG325I is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It delivers a high density of programmable logic and on-chip RAM in a compact 325-TFBGA (11×11) package for industrial applications.

With 56,340 logic elements, approximately 1.87 Mbits of embedded memory, 200 user I/Os, and a broad supply and temperature range, this device supports flexible power envelopes and reliable operation across industrial environments.

Key Features

  • Core Logic  Approximately 56,340 logic elements provide substantial programmable fabric for complex digital functions and custom logic implementations.
  • Embedded Memory  Approximately 1.87 Mbits of on-chip RAM for buffering, temporary storage, and data processing local to the fabric.
  • I/O  200 user I/Os to support a wide range of peripheral interfaces and I/O connectivity requirements.
  • Power Supply Range  Operates across a supply range of 1.14 V to 2.625 V, enabling flexible power-design choices.
  • Package and Mounting  325-TFBGA (11×11) package in a surface-mount form factor for compact board-level integration.
  • Industrial Temperature Grade  Rated for operation from −40°C to 100°C to accommodate industrial temperature environments.
  • Regulatory  RoHS compliant.

Typical Applications

  • Industrial Control  Use the device for programmable logic in automation systems where industrial temperature range and high I/O count are required.
  • Embedded Processing  Implement custom data paths and control logic leveraging the device’s large logic element count and on-chip RAM.
  • Communication Interfaces  Support protocol bridging and I/O aggregation using the 200 available user I/Os for diverse interface requirements.
  • Instrumentation and Measurement  Deploy in test and measurement equipment that benefits from local memory and dense programmable logic in a compact package.

Unique Advantages

  • High Logic Density:  56,340 logic elements enable implementation of complex custom logic and multiple functions on a single device, reducing board-level BOM.
  • Significant On-Chip Memory:  Approximately 1.87 Mbits of embedded RAM reduces reliance on external memory for buffering and accelerates local data handling.
  • Generous I/O Capacity:  200 user I/Os provide flexibility to connect sensors, actuators, and communication peripherals without extensive external multiplexing.
  • Wide Voltage Flexibility:  1.14 V to 2.625 V supply range supports a variety of power-architecture choices and can help optimize overall system power.
  • Industrial Temperature Range:  −40°C to 100°C rating supports deployment in harsher thermal environments common to industrial systems.
  • Compact Surface-Mount Package:  325-TFBGA (11×11) footprint enables space-efficient PCB designs while retaining high integration.

Why Choose M2GL050TS-FCSG325I?

The M2GL050TS-FCSG325I positions itself as a robust, high-density FPGA option for industrial designs that require substantial programmable logic, embedded memory, and flexible I/O. Its combination of logic capacity, on-chip RAM, and wide operating conditions makes it suitable for embedded processing, control, and interface tasks where reliability and integration are key.

Manufactured by Microchip Technology and offered in a compact 325-TFBGA surface-mount package with RoHS compliance, this device provides a balanced platform for engineers seeking to consolidate functions, reduce external components, and maintain operation across industrial temperature ranges.

Request a quote or submit an inquiry to purchase the M2GL050TS-FCSG325I and evaluate how its logic density, memory, and I/O capabilities can fit your next industrial design.

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