M2GL050TS-FG484I
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 267 1869824 56340 484-BGA |
|---|---|
| Quantity | 577 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 267 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56340 | Number of Logic Elements/Cells | 56340 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1869824 |
Overview of M2GL050TS-FG484I – IGLOO2 Field Programmable Gate Array (FPGA), 484-BGA
The M2GL050TS-FG484I is an IGLOO2 field programmable gate array (FPGA) from Microchip Technology. It provides reconfigurable digital logic in a 484-ball BGA package with surface-mount mounting and an industrial-grade temperature rating.
With 56,340 logic elements, approximately 1.87 Mbits of embedded memory, and 267 I/Os, this device is suited to designs that require substantial on-chip logic capacity, mid-range embedded memory, and a high I/O count within a compact 23 × 23 mm FPBGA footprint. The device supports a wide supply range and extended operating temperature for industrial applications.
Key Features
- Core Logic Approximately 56,340 logic elements provide on-chip programmable resources for custom digital functions and IP integration.
- Embedded Memory Approximately 1.87 Mbits of on-chip RAM available for buffering, state storage, and small data structures.
- I/O Density 267 I/Os support extensive sensor, peripheral and bus interfacing without external I/O expanders.
- Power Supply Range Supports supply voltages from 1.14 V to 2.625 V, enabling compatibility with a range of core and I/O power domains.
- Package & Mounting 484-FPBGA (23×23) package / 484-BGA package case in a surface-mount format for compact board-level integration.
- Temperature & Grade Industrial-grade qualification with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
- Regulatory RoHS compliant construction supports environmentally conscious product designs.
Typical Applications
- Industrial Control Leverages industrial-grade temperature range and high I/O count to implement motor control logic, sensor interfacing, and machine control functions.
- Embedded Systems Uses the device’s logic capacity and on-chip memory to implement custom processing, protocol handling, and glue logic within embedded appliances and equipment.
- Communications & Networking Employs the FPGA’s I/O density and reconfigurable logic for protocol adaptation, timing control, and peripheral aggregation in mid-range communications equipment.
Unique Advantages
- Substantial On-Chip Logic: 56,340 logic elements allow consolidation of multiple functions into a single device, reducing board-level component count.
- Integrated Memory: Approximately 1.87 Mbits of embedded RAM supports local buffering and state retention without immediate need for external memory.
- High I/O Capability: 267 I/Os enable direct connection to a wide range of sensors, peripherals, and buses, simplifying system routing and connectors.
- Industrial Temperature Range: Rated from −40 °C to 100 °C for reliable operation in harsh or temperature-variable industrial environments.
- Compact BGA Package: 484-FPBGA (23×23) delivers a high-pin-count solution in a compact surface-mount form factor for space-constrained designs.
- Flexible Power Options: Support for 1.14 V to 2.625 V supply rails helps align the device with common core and I/O voltage domains.
Why Choose M2GL050TS-FG484I?
The M2GL050TS-FG484I positions itself as a robust, industrial-grade FPGA option that balances substantial logic capacity, on-chip memory, and a high I/O count in a compact 484-ball FPBGA package. Its extended operating temperature range and RoHS compliance make it suitable for long-lived, environmentally conscious designs that require reliable reconfigurable logic.
This device is well suited for engineers building industrial control systems, embedded platforms, or communications equipment who need significant programmable resources, substantial I/O connectivity, and a compact board footprint. The combination of logic density, embedded RAM, and flexible supply range supports scalable designs and simplifies BOM decisions.
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