M2GL060-FCS325

The M2GL060-FCS325 is an IGLOO2 series Field Programmable Gate Array (FPGA) IC offered in a 325-ball FCBGA/TFBGA package. It provides a high-density programmable logic fabric with embedded on-chip memory and a flexible I/O count for mid- to high-complexity embedded logic designs.

This commercial-grade device delivers 56,520 logic elements, approximately 1.87 Mbits of embedded RAM, and up to 200 I/Os. It supports supply voltages from 1.14 V to 2.625 V and is rated for operation from 0 °C to 85 °C, with RoHS compliance for lead-free assembly.

Key Features

• Programmable Logic Capacity  Provides 56,520 logic elements for implementing complex combinational and sequential logic.
• Embedded Memory  Approximately 1.87 Mbits of on-chip RAM to support buffering, state storage, and embedded data structures without external memory.
• I/O Capability  Up to 200 I/Os to accommodate multiple peripheral interfaces, signal routing and board-level connectivity.
• Power Supply Range  Supports voltage supply range from 1.14 V to 2.625 V for flexible integration with system rails.
• Package and Mounting  Supplied in a 325-TFBGA / 325-FCBGA (11×11) package for surface-mount assembly and compact board layouts.
• Operating Conditions  Commercial-grade device rated for 0 °C to 85 °C ambient operation.
• Regulatory Compliance  RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

• Custom Logic Acceleration  Implement application-specific datapaths and control logic using the device’s 56,520 logic elements and embedded RAM.
• I/O Aggregation and Bridging  Use the 200 I/Os to consolidate multiple interfaces or implement protocol translation and glue logic on a single device.
• Embedded System Integration  Leverage on-chip memory and dense logic to integrate state machines, buffering, and peripheral control in compact designs.

Unique Advantages

• High Logic Density:  56,520 logic elements enable substantial on-chip implementation of complex functions without immediate reliance on external processors.
• Significant On-Chip Memory:  Approximately 1.87 Mbits of embedded RAM reduces the need for external memory in many buffering and state-storage use cases.
• Flexible I/O Count:  200 I/Os provide broad connectivity for multi-signal interfaces and board-level consolidation.
• Compact Surface-Mount Package:  Available in a 325-FCBGA (11×11) / 325-TFBGA package to support dense PCB layouts and small form-factor assemblies.
• Wide Supply Compatibility:  Support for 1.14 V to 2.625 V supply rails enables integration with a range of system power architectures.
• Commercial Temperature Grade:  Rated 0 °C to 85 °C for standard commercial applications and environments.

Why Choose M2GL060-FCS325?

The M2GL060-FCS325 balances high logic density, substantial embedded memory, and a large I/O count in a compact 325-ball BGA package. Its voltage flexibility and RoHS compliance make it a practical choice for commercial embedded designs that require integrated logic, memory, and extensive board-level connectivity.

This FPGA is suitable for development teams and OEMs looking to consolidate functions into a single programmable device while maintaining straightforward surface-mount assembly and commercial temperature operation. It offers a clear hardware platform for designs that require moderate to high on-chip logic and memory resources.

Request a quote or submit an RFQ to obtain pricing and availability for the M2GL060-FCS325 and begin integrating this IGLOO2 FPGA into your next design.