M2GL060-FG484
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 267 1869824 56520 484-BGA |
|---|---|
| Quantity | 267 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 267 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56520 | Number of Logic Elements/Cells | 56520 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 1869824 |
Overview of M2GL060-FG484 – IGLOO2 Field Programmable Gate Array (FPGA) IC, 267 I/O, ~1.87 Mbits RAM, 56,520 logic elements, 484-BGA
The M2GL060-FG484 is an IGLOO2 Field Programmable Gate Array (FPGA) offered in a 484-ball BGA package. It delivers 56,520 logic elements and approximately 1.87 Mbits of embedded memory, with 267 user I/O pins, making it suitable for commercial embedded designs that require substantial programmable logic capacity and on-chip RAM.
Engineered for surface-mount PCB assembly and RoHS-compliant production, this device supports a wide supply voltage range and a commercial operating temperature range for reliable deployment in many standard electronic applications.
Key Features
- Logic Capacity — 56,520 logic elements provide significant programmable logic resources for custom digital functions and control logic.
- Embedded Memory — Approximately 1.87 Mbits of on-chip RAM to support buffers, state storage, and intermediate data processing without external memory.
- I/O Count — 267 user I/O pins to support multiple peripheral interfaces and signal routing on complex boards.
- Power — Flexible supply operation with a voltage range from 1.14 V to 2.625 V to accommodate varied system power architectures.
- Package & Mounting — 484-BGA package (supplier device package: 484-FPBGA, 23 × 23 mm) designed for surface-mount assembly.
- Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant for lead-free manufacturing and regulatory alignment.
Typical Applications
- Commercial Embedded Systems — Implement control logic, state machines, and programmable interfaces where significant logic capacity and I/O are required.
- Prototyping and Development — Rapidly validate custom digital designs and iterate hardware/software integration using on-chip logic and memory resources.
- Interface Bridging and Glue Logic — Consolidate multiple interface conversions and glue logic functions leveraging the device’s I/O count and embedded RAM.
- Custom Accelerators — Create application-specific datapath or processing blocks that benefit from the available logic elements and on-chip memory.
Unique Advantages
- High Logic Density: 56,520 logic elements enable complex logic implementations while reducing the need for multiple discrete devices.
- On-Chip Memory: Approximately 1.87 Mbits of embedded RAM reduces dependence on external memory and simplifies board design.
- Generous I/O Count: 267 I/O pins support diverse peripheral connections and flexible board-level signal routing.
- Flexible Power Envelope: A broad supply voltage range (1.14 V to 2.625 V) accommodates different system power domains and design choices.
- Surface-Mount BGA Package: 484-FPBGA (23 × 23 mm) provides a compact, manufacturable form factor for modern PCB layouts.
- RoHS Compliant: Supports lead-free manufacturing flows and regulatory requirements for commercial products.
Why Choose M2GL060-FG484?
The M2GL060-FG484 positions itself as a high-capacity, commercially graded FPGA option for designers who need extensive programmable logic, embedded memory, and a large number of I/O in a compact BGA package. Its combination of logic elements, on-chip RAM, and I/O density supports a broad set of commercial embedded applications where integration and board-level simplification are priorities.
With a flexible supply voltage range, surface-mount 484-BGA packaging, and RoHS compliance, this device offers a balance of integration and manufacturability for teams focused on scalable, reliable commercial designs. It is well suited to engineering groups developing custom accelerators, protocol bridges, and feature-rich embedded systems.
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