M2GL060-FG676

The M2GL060-FG676 is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for surface-mount board integration. It provides a high-density programmable fabric with 56,520 logic elements and approximately 1.87 Mbits of embedded memory, supporting designs that require substantial on-chip logic and RAM.

This device offers a broad I/O count and a flexible supply range while meeting commercial-grade temperature and RoHS compliance requirements, making it suitable for a range of electronic applications that need configurable logic, moderate operating temperatures, and compact BGA packaging.

Key Features

• Core Logic  56,520 logic elements provide a sizable programmable fabric for implementing custom logic, state machines, and data-paths.
• Embedded Memory  Approximately 1.87 Mbits of on-chip RAM to support buffering, FIFOs, and embedded data structures without external memory.
• I/O Capacity  387 user I/Os to interface with peripherals, sensors, and external devices while enabling broad system connectivity.
• Power Supply  Operates across a supply range of 1.14 V to 2.625 V, allowing integration with different core and I/O voltage domains.
• Package & Mounting  676-ball BGA package (supplier package: 676-FBGA (27×27)) in a surface-mount form factor for compact board layouts.
• Temperature & Grade  Commercial grade operation with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS-compliant construction for environmental and assembly process compatibility.

Unique Advantages

• High logic density: 56,520 logic elements enable complex custom logic implementations on a single device, reducing external component count.
• On-chip memory capacity: Approximately 1.87 Mbits of embedded RAM supports local buffering and data handling without immediate reliance on external memory.
• Extensive I/O complement: 387 I/Os provide flexibility for multi-channel interfacing and integration with diverse peripherals.
• Flexible power integration: Wide supply range (1.14 V–2.625 V) helps accommodate different system voltage domains and power architectures.
• Compact BGA packaging: 676-BGA (676-FBGA, 27×27) surface-mount package enables dense PCB layouts while maintaining a high ball-count I/O footprint.
• Commercial-grade and RoHS-compliant: Designed for standard commercial environments with lead-free compliance for modern assembly processes.

Why Choose M2GL060-FG676?

The M2GL060-FG676 delivers a balanced combination of programmable logic density, embedded memory, and a large I/O count in a compact 676-BGA surface-mount package. Its supply voltage range and commercial operating temperature make it well suited for mainstream embedded applications that require configurable hardware, significant on-chip resources, and a compact board footprint.

Engineers and purchasers looking for a Microchip IGLOO2 FPGA with substantial logic and memory capacity, broad I/O, and RoHS compliance will find this device appropriate for designs where integration, scalability, and standard-temperature commercial operation are priorities.

Request a quote or contact sales to discuss availability, pricing, and how M2GL060-FG676 can fit your next design.