M2GL060-FGG676

The M2GL060-FGG676 is an IGLOO2 family FPGA from Microchip Technology. It provides a high-capacity, commercially graded programmable logic device in a compact BGA package for embedded digital designs.

Key on-chip resources include 56,520 logic elements, approximately 1.87 Mbits of embedded RAM, and 387 user I/Os. The device ships in a 676-FBGA (27×27) surface-mount package, operates from 1.14 V to 2.625 V, and is specified for 0 °C to 85 °C operation. The part is RoHS compliant.

Key Features

• Logic Elements 56,520 logic elements for implementing complex custom logic and state machines.
• Embedded Memory Approximately 1.87 Mbits (1,869,824 bits) of on-chip RAM for buffering, lookup tables, and data storage.
• User I/O 387 I/O pins to support a wide range of external interfaces and board-level connectivity.
• Power Voltage supply range from 1.14 V to 2.625 V to accommodate different core and I/O supply requirements.
• Package and Mounting 676-FBGA (27×27) package case, supplied as a 676-BGA, designed for surface-mount assembly.
• Temperature and Grade Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Environmental RoHS compliant for lead-free manufacturing processes.

Typical Applications

• Custom Digital Logic Use the FPGA’s 56,520 logic elements and embedded RAM to implement bespoke digital functions and data processing pipelines.
• High-Density I/O Control 387 user I/Os allow the part to interface with multiple peripherals, sensors, and board-level subsystems.
• Embedded System Integration Compact 676-FBGA package and surface-mount mounting make it suitable for space-constrained commercial embedded designs operating within 0 °C to 85 °C.

Unique Advantages

• High Logic Capacity: 56,520 logic elements provide the resources needed for large-scale combinational and sequential designs.
• Significant On-Chip Memory: Approximately 1.87 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks.
• Extensive I/O Resources: 387 I/Os enable flexible connectivity and parallel interfacing with external components.
• Compact, Assembly-Friendly Package: 676-FBGA (27×27) surface-mount package supports dense board layouts and standard assembly processes.
• Flexible Power Options: Wide supply range (1.14 V to 2.625 V) supports different power architectures and I/O levels.
• Commercial-Grade and Compliant: Designed for commercial applications and RoHS compliant to meet common manufacturing requirements.

Why Choose M2GL060-FGG676?

The M2GL060-FGG676 positions itself as a commercially graded IGLOO2 FPGA that combines substantial logic capacity, on-chip memory, and a high I/O count in a compact 676-FBGA package. It is suitable for designers who need a programmable solution with measurable on-chip resources and a defined operating range.

Its specification set—56,520 logic elements, approximately 1.87 Mbits of RAM, 387 I/Os, RoHS compliance, and operation from 0 °C to 85 °C—makes it a practical choice for commercial embedded designs that require dense logic, embedded storage, and broad I/O connectivity.

Request a quote or submit an inquiry to our sales team to check availability and pricing for the M2GL060-FGG676 and to discuss how it fits your next design.