M2GL060-FGG676I

The M2GL060-FGG676I is an IGLOO2 field programmable gate array (FPGA) IC from Microchip Technology, supplied in a 676‑ball BGA package. It delivers substantial on-chip logic and memory resources together with a high I/O count suitable for demanding embedded designs.

With 56,520 logic elements, approximately 1.87 Mbits of embedded RAM and 387 I/Os, this device is positioned for applications that require significant programmable logic, dense external interfacing, and operation across an extended industrial temperature range.

Key Features

• Core — Logic Capacity 56,520 logic elements (cells) provide the programmable fabric for complex custom logic and control functions.
• On‑chip Memory Approximately 1.87 Mbits of embedded RAM for local buffering, state storage, and data processing tasks.
• High I/O Count 387 available I/Os to support wide parallel interfaces, multiple peripherals, and dense external connectivity.
• Package & Mounting 676‑FBGA package (27 × 27 mm) with surface mount construction for compact board-level integration.
• Power Supply Range Operates from 1.14 V to 2.625 V, enabling flexibility for different system power domains.
• Industrial Temperature Grade Specified to operate from −40°C to 100°C for use in industrial environments.
• Regulatory Compliance RoHS compliant for lead‑free manufacturing and regulatory alignment.

Typical Applications

• Industrial Control Implement custom control logic and protocol handling where industrial temperature operation and reliable logic capacity are required.
• I/O‑Dense Interfaces Bridge multiple high‑pin-count sensors, peripherals, or parallel buses using the device’s 387 I/Os.
• Embedded Logic & Acceleration Offload deterministic, latency‑sensitive tasks to dedicated FPGA logic using the 56,520 logic elements and on‑chip RAM.
• Board‑Level Integration Use the compact 676‑FBGA package for space‑constrained designs that need high logic density and connectivity.

Unique Advantages

• Highly integrated logic and memory: Combines 56,520 logic elements with approximately 1.87 Mbits of RAM to reduce external component count and simplify system architecture.
• Large I/O resource: 387 I/Os enable direct connection to numerous peripherals and buses without extensive external multiplexing.
• Flexible power envelope: Broad supply range from 1.14 V to 2.625 V supports integration into varied power architectures.
• Industrial temperature capability: Rated from −40°C to 100°C for reliable operation in harsher environments.
• Compact BGA footprint: 676‑FBGA (27×27 mm) packaging offers a balance of high pin count and board‑space efficiency.
• RoHS compliant: Suitable for lead‑free manufacturing and compliant production processes.

Why Choose M2GL060-FGG676I?

The M2GL060-FGG676I from Microchip Technology provides a balanced combination of logic density, embedded memory, and I/O capacity in a compact industrial‑grade package. Its specification set — including 56,520 logic elements, approximately 1.87 Mbits of RAM, 387 I/Os, and a wide operating temperature range — makes it well suited to embedded systems that require substantial programmable resources and robust environmental performance.

This device is appropriate for design teams needing scalable FPGA capacity, strong board‑level integration, and flexibility in power and I/O configuration. Its packaging and regulatory compliance characteristics support production readiness for industrial applications where long‑term reliability matters.

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