M2GL060-FGG484

The M2GL060-FGG484 is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology, delivered in a 484-ball fine-pitch BGA package. It provides a high logic-density programmable fabric with a large number of I/Os and embedded memory, suitable for designers requiring consolidated programmable logic in a compact surface-mount footprint.

Key device attributes include 56,520 logic elements, approximately 1.87 Mbits of on-chip RAM, 267 I/Os, a wide supply voltage range (1.14 V to 2.625 V), and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity – 56,520 logic elements for implementing complex digital functions and high-density logic integration.
• Embedded Memory – Approximately 1.87 Mbits of on-chip RAM to support data buffering, state storage, and local memory requirements.
• I/O Resources – 267 dedicated I/O pins to support multiple interfaces and board-level connectivity within a single device.
• Power and Supply – Flexible voltage supply range from 1.14 V to 2.625 V for compatibility with a variety of system power domains.
• Package and Mounting – 484-FPBGA (23×23) package, surface-mount mounting type, offering a compact solution for space-constrained designs.
• Operational Range – Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Regulatory Compliance – RoHS compliant for environmentally conscious designs and manufacturing.

Typical Applications

• System Integration and Glue Logic – Consolidate multiple discrete functions into a single programmable device using the high logic element count and ample I/O.
• Interface Bridging and Protocol Conversion – Implement protocol translators and interface logic leveraging 267 I/Os and on-chip memory.
• Embedded Control and State Machines – Use the device’s logic resources and RAM for control algorithms, sequencing, and deterministic hardware state machines.
• Prototyping and Low- to Mid-Volume Production – Deploy programmable logic for validation, iterative development, and production where BOM reduction and reprogrammability are advantageous.

Unique Advantages

• High Logic Density: 56,520 logic elements enable consolidation of complex digital functions, reducing board-level component count.
• Substantial On-Chip Memory: Approximately 1.87 Mbits of embedded RAM minimize external memory needs for buffering and local data handling.
• Extensive I/O Count: 267 I/Os provide flexibility for multiple interfaces and mixed-signal front-ends without adding external glue logic.
• Flexible Power Options: Wide supply voltage range (1.14 V–2.625 V) allows integration into varied system power architectures.
• Compact BGA Package: 484-FPBGA (23×23) offers a small footprint for dense board layouts while supporting surface-mount assembly.
• RoHS Compliant: Supports environmentally compliant manufacturing processes and requirements.

Why Choose M2GL060-FGG484?

The M2GL060-FGG484 delivers a balance of high logic capacity, substantial embedded memory, and a large I/O count in a compact 484-BGA surface-mount package. It is positioned for designers who need to consolidate digital logic, interfaces, and control functions into a single programmable device while operating within commercial temperature ranges.

This device is suitable for projects that prioritize integration, reconfigurability, and space-efficient board design. Backed by Microchip Technology’s IGLOO2 family, it provides a scalable option for engineers seeking programmable logic with verified silicon in a standard commercial-grade offering.

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