M2GL060-FG484I

The M2GL060-FG484I is an IGLOO2 Field Programmable Gate Array (FPGA) IC that provides a balanced combination of logic capacity, embedded memory and I/O density in a compact 484‑BGA package. With 56,520 logic elements and approximately 1.87 Mbits of on‑chip RAM, this device is intended for designs that require substantial programmable logic and a high number of I/O connections while meeting industrial temperature requirements.

Designed for surface-mount integration, the device supports a wide core supply range and is RoHS compliant, making it suitable for industrial-grade electronic designs that need scalable programmable logic resources.

Key Features

• FPGA Core  IGLOO2 architecture with 56,520 logic elements for implementing custom digital logic.
• Embedded Memory  Total on‑chip RAM of 1,869,824 bits (approximately 1.87 Mbits) to support buffering and local storage.
• I/O Density  267 total I/O pins to accommodate wide peripheral and system interfacing requirements.
• Power and Supply  Operates across a supply range of 1.14 V to 2.625 V, allowing flexibility in system power architectures.
• Package and Mounting  484‑FPBGA supplier device package (23×23) / 484‑BGA package case configured for surface‑mount assembly.
• Temperature and Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for demanding environments.
• Regulatory Compliance  RoHS compliant to support environmentally conscious designs.

Unique Advantages

• High logic capacity: 56,520 logic elements provide ample resources for medium‑to‑large FPGA designs without external logic.
• Substantial on‑chip RAM: Approximately 1.87 Mbits of embedded memory reduces dependence on external memory for many buffering and state‑storage needs.
• Rich I/O count: 267 I/O pins enable extensive peripheral connectivity and flexible system interfacing.
• Industrial robustness: Rated for −40 °C to 100 °C operation, supporting deployment in temperature‑sensitive industrial applications.
• Flexible power integration: Wide supply range (1.14 V–2.625 V) accommodates various system power designs.
• Compact, assembly‑ready package: 484‑FPBGA (23×23) surface‑mount package supports high‑density board layouts.

Why Choose M2GL060-FG484I?

The M2GL060-FG484I positions itself as a versatile IGLOO2 FPGA offering a strong blend of logic capacity, embedded memory and I/O resources in an industrial‑grade package. Its combination of 56,520 logic elements, approximately 1.87 Mbits of on‑chip RAM, 267 I/O pins and a broad operating voltage range makes it suitable for embedded systems that need scalable programmable logic and robust environmental performance.

This device is well suited to engineers and procurement teams looking for a RoHS‑compliant, surface‑mount FPGA solution with a compact 484‑BGA footprint and industrial temperature rating, providing long‑term value through integration and flexibility in system design.

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