M2GL060-FCS325I

The M2GL060-FCS325I is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology, offered in a 325-ball TFBGA/FCBGA package. It provides a high-density programmable-logic fabric with a substantial on-chip memory footprint and a 200-pin I/O complement, intended for industrial-grade embedded designs.

With a logic capacity of 56,520 logic elements and approximately 1.87 Mbits of embedded memory, this device targets applications that require significant programmable logic, on-chip RAM, and flexible I/O while operating across a broad temperature and voltage range.

Key Features

• FPGA Core IGLOO2 Field Programmable Gate Array architecture providing 56,520 logic elements for custom digital logic implementations.
• Embedded Memory Approximately 1.87 Mbits of total on-chip RAM to support data buffering, state machines, and intermediate storage.
• I/O Density 200 user I/Os to accommodate multiple interfaces, sensor inputs, and control signals.
• Power Flexible voltage supply range from 1.14 V to 2.625 V to match a variety of system power rails.
• Package and Mounting 325-TFBGA / FCBGA package (supplier device package 325-FCBGA, 11×11) in a surface-mount form factor for compact board-level integration.
• Temperature Range Industrial operating range from −40 °C to 100 °C suitable for demanding environmental conditions.
• Compliance RoHS compliant for reduction of restricted substances in manufacturing.

Typical Applications

• Industrial Control: Implement custom control logic and real-time processing in industrial automation equipment that benefits from industrial temperature ratings and flexible I/O.
• Embedded Systems: Integrate programmable logic and on-chip RAM into embedded platforms requiring custom data paths or protocol handling.
• I/O-Intensive Designs: Aggregate multiple sensor, actuator, or interface signals using the device's 200 I/Os and on-chip resources for compact system designs.

Unique Advantages

• High Logic Capacity: 56,520 logic elements enable complex combinational and sequential logic implementations on a single device.
• Substantial On-Chip Memory: Approximately 1.87 Mbits of embedded RAM reduces external memory dependency and simplifies board design for buffering and local storage.
• Generous I/O Count: 200 I/Os allow consolidation of multiple interfaces and peripheral connections without additional multiplexing hardware.
• Wide Voltage Flexibility: 1.14 V to 2.625 V supply range supports integration into diverse power architectures.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in harsh or temperature-variable environments.
• Compact BGA Package: 325-TFBGA/FCBGA (11×11) surface-mount package helps reduce PCB area while providing the routing density needed for complex designs.

Why Choose M2GL060-FCS325I?

The M2GL060-FCS325I positions itself as a capable IGLOO2 FPGA option for engineers seeking a balance of logic density, embedded memory, and I/O flexibility in an industrial-grade package. Its broad operating voltage and temperature ranges, together with RoHS compliance, make it suitable for long-lived embedded designs where environmental robustness and regulatory compliance matter.

This device is suited to development teams and system designers who need on-chip resources to minimize external components, consolidate board-level functionality, and maintain flexibility for future feature updates through programmable logic.

Request a quote or submit your specification to receive pricing and availability information for the M2GL060-FCS325I.