M2GL060-FCSG325

The M2GL060-FCSG325 is an IGLOO2 field programmable gate array (FPGA) device in a 325-TFBGA (325-FCBGA, 11×11) package. It combines a high logic element count with on-chip embedded memory and a substantial number of I/O to address designs that require configurable digital logic and local memory resources.

Designed for commercial-temperature applications, the device offers a broad supply voltage range and surface-mount packaging to support compact, board-level implementations where programmable logic, memory, and I/O density are required.

Key Features

• Core / FPGA Type  IGLOO2 field programmable gate array providing reconfigurable logic for custom digital functions.
• Logic Capacity  Approximately 56,520 logic elements for implementing complex combinational and sequential logic.
• Embedded Memory  Approximately 1.87 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
• I/O  200 general-purpose I/O pins to interface with peripherals, sensors, and external logic.
• Power and Supply  Operates from 1.14 V to 2.625 V, providing flexibility for different power-domain architectures.
• Package and Mounting  325-TFBGA (325-FCBGA, 11×11) package in a surface-mount form factor for compact PCB integration.
• Temperature Range  Commercial grade operation from 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Programmable Logic Integration  Implement custom data paths, control logic, and protocol bridging using the device's reconfigurable logic and embedded memory.
• I/O-Intensive Designs  Leverage 200 I/O pins to connect multiple sensors, peripherals, or external interfaces.
• Space-Constrained Systems  Surface-mount 325-TFBGA packaging supports compact board layouts where board area is limited.

Unique Advantages

• High Logic Density:  56,520 logic elements provide substantial capacity for complex logic implementations without external programmable devices.
• Significant On-Chip Memory:  Approximately 1.87 Mbits of embedded RAM reduce reliance on external memory for buffering and local storage.
• Generous I/O Count:  200 I/O pins enable broad peripheral connectivity and flexible system partitioning.
• Wide Supply Range:  Support for 1.14 V to 2.625 V allows integration into diverse power architectures and multiple I/O voltage domains.
• Compact, Surface-Mount Package:  325-FCBGA (11×11) helps minimize PCB footprint while maintaining high integration.
• RoHS Compliant:  Meets environmental standards for lead-free assembly and regulatory requirements.

Why Choose M2GL060-FCSG325?

The M2GL060-FCSG325 positions itself as a high-capacity IGLOO2 FPGA option for commercial-temperature designs that require a combination of substantial logic resources, embedded memory, and a high number of I/O in a compact surface-mount package. Its supply voltage flexibility and RoHS compliance make it suitable for a variety of board-level implementations.

This device is well suited for engineers and procurement teams looking for a programmable logic solution that balances logic density, on-chip memory, and I/O count while fitting into space-constrained designs and standard commercial operating environments.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the M2GL060-FCSG325.