M2GL060-FG676I

The M2GL060-FG676I from Microchip Technology is an IGLOO2 series Field Programmable Gate Array (FPGA) packaged in a 676-BGA footprint. It integrates 56,520 logic elements and approximately 1.87 Mbits of embedded memory, alongside 387 user I/O pins, providing a compact, industrial-grade programmable fabric suitable for embedded and industrial applications.

Designed for surface-mount assembly, the device supports a wide operating voltage range (1.14 V to 2.625 V) and an industrial temperature range of −40 °C to 100 °C, enabling robust operation across varied system environments.

Key Features

• Core Logic 56,520 logic elements for implementing custom digital functions and complex finite-state logic.
• Embedded Memory Approximately 1.87 Mbits of on-chip RAM to support buffering, look-up tables, and state storage without external memory.
• I/O Resources 387 user I/Os to accommodate broad interfacing requirements for sensors, peripherals, and board-level signals.
• Power Supply Flexibility Operates across a 1.14 V to 2.625 V supply window to match diverse system power architectures.
• Package & Mounting 676-BGA package (supplier package: 676-FBGA, 27×27) in a surface-mount configuration for compact board integration.
• Industrial Temperature Range Rated for −40 °C to 100 °C operation to meet industrial-environment thermal requirements.
• RoHS Compliant Meets RoHS environmental requirements for lead-free assembly and compliance considerations.

Unique Advantages

• High logic density: 56,520 logic elements enable implementation of substantial digital designs on a single device, reducing board-level component count.
• Integrated memory capacity: Approximately 1.87 Mbits of embedded RAM helps minimize reliance on external memory, simplifying design and lowering BOM cost.
• Generous I/O availability: 387 user I/Os provide flexibility for multiple interfaces and complex system connectivity without external multiplexing.
• Wide voltage compatibility: The 1.14 V to 2.625 V supply range allows integration into varied power domains and legacy systems.
• Industrial-grade thermal range: Qualified for −40 °C to 100 °C operation, supporting deployment in demanding environments.
• Compact BGA package: 676-BGA (676-FBGA, 27×27) surface-mount package enables dense PCB layouts and efficient board-level integration.

Why Choose M2GL060-FG676I?

The M2GL060-FG676I positions itself as a high-capacity, industrial-grade IGLOO2 FPGA that balances logic density, embedded memory, and extensive I/O in a compact BGA package. Its wide supply voltage window and broad operating temperature range make it suitable for engineers designing robust embedded systems that require significant programmable logic on a single device.

This device is well suited for designs where integration, thermal robustness, and flexible interfacing are priorities. Selecting the M2GL060-FG676I supports longer-term design stability through a combination of substantial on-chip resources and industrial operating tolerances.

Request a quote or submit a purchasing inquiry today to evaluate the M2GL060-FG676I for your next FPGA-based design.