M2GL060TS-1FG676I

The M2GL060TS-1FG676I is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology, provided in a 676-BGA surface-mount package. It is specified as an industrial-grade device and is RoHS compliant.

With 56,520 logic elements, approximately 1.87 Mbits of embedded memory and 387 I/O, this FPGA targets designs that require substantial on-chip logic, memory and I/O capacity within a compact BGA footprint. The device supports a supply voltage range of 1.14 V to 2.625 V and an operating temperature range of −40 °C to 100 °C.

Key Features

• Core Logic — 56,520 logic elements provide the programmable fabric required for complex custom logic implementations.
• Embedded Memory — Approximately 1.87 Mbits of on-chip RAM for data buffering, state storage and small lookup tables.
• I/O Capacity — 387 I/O pins to support extensive peripheral and interface connectivity.
• Power — Operates across a supply voltage range of 1.14 V to 2.625 V for flexible integration with varied power domains.
• Package & Mounting — 676-BGA package, supplier device package 676-FBGA (27×27); surface-mount mounting for high-density board designs.
• Environmental & Compliance — Industrial grade with an operating temperature range of −40 °C to 100 °C; RoHS compliant.

Typical Applications

• Industrial Control & Automation — Industrial-grade temperature range and extensive logic and I/O count support custom control functions and interface requirements.
• Communications & Networking — High I/O count and on-chip memory enable protocol handling, buffering and custom data paths.
• Embedded Systems & Instrumentation — Compact 676-FBGA package combined with reprogrammable logic and embedded RAM suits space-constrained embedded designs.

Unique Advantages

• High Logic Capacity: 56,520 logic elements enable substantial programmable logic integration without external CPLDs or additional FPGAs.
• Substantial On-Chip Memory: Approximately 1.87 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage tasks.
• Dense I/O: 387 I/O pins provide flexibility for connecting multiple peripherals, interfaces and system buses.
• Industrial Temperature Support: −40 °C to 100 °C operating range suits deployment in demanding environmental conditions.
• Flexible Power Integration: 1.14 V to 2.625 V supply range allows adaptation to a variety of system power architectures.
• Compact, High-Density Package: 676-FBGA (27×27) surface-mount package supports small form-factor boards and dense PCB layouts.

Why Choose M2GL060TS-1FG676I?

The M2GL060TS-1FG676I delivers a balanced combination of logic capacity, embedded memory and high I/O count in a compact 676-FBGA package. Its industrial-grade temperature range and RoHS compliance make it suitable for designs that require reliability across a wide range of operating conditions.

Backed by Microchip Technology, this IGLOO2 FPGA is appropriate for engineers and procurement teams seeking a reprogrammable, high-density logic device for industrial control, communications, and embedded applications where on-chip resources and compact packaging are important.

Request a quote for the M2GL060TS-1FG676I or submit your purchasing inquiry today to get pricing and availability details.