M2GL060TS-1FGG484

The M2GL060TS-1FGG484 is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for commercial embedded designs. It combines 56,520 logic elements with approximately 1.87 Mbits of embedded memory and 267 general-purpose I/O to address logic-intensive, I/O-heavy implementations in a compact surface-mount package.

The device supports a wide supply voltage range and a standard commercial operating temperature range, offering flexibility for a variety of board-level applications while meeting RoHS environmental compliance.

Key Features

• Core Capacity — 56,520 logic elements for implementing complex logic and combinational/sequential functions.
• Embedded Memory — Approximately 1.87 Mbits of on-chip RAM for buffering, packet storage, and small lookup tables.
• I/O Density — 267 I/O pins to support high pin-count interfacing and multiple parallel buses or peripheral connections.
• Power Supply Flexibility — Operates from 1.14 V to 2.625 V to accommodate varied power architectures and IO standards on the host board.
• Package and Mounting — 484-FPBGA (23×23) package in a 484-BGA footprint with surface-mount mounting for compact board integration.
• Operating Range — Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance — RoHS compliant for regulatory alignment in commercial products.

Typical Applications

• I/O-Intensive Embedded Control — Use the 267 I/O pins to handle multiple sensors, actuators, or parallel interfaces in compact systems.
• Logic Consolidation — Leverage 56,520 logic elements to combine multiple discrete logic functions into a single FPGA, simplifying BOM and board routing.
• On-Board Memory Tasks — Utilize approximately 1.87 Mbits of embedded RAM for buffering, small data queues, and lookup tables in real-time processing tasks.
• Compact, Surface-Mount Designs — The 484-FPBGA (23×23) package supports space-constrained PCBs where high integration and surface-mount assembly are required.

Unique Advantages

• High Logic Density: 56,520 logic elements enable implementation of complex state machines and custom datapaths without external glue logic.
• Generous On-Chip Memory: Approximately 1.87 Mbits of embedded RAM reduces dependence on off-chip memory for many buffering and LUT needs.
• Extensive I/O Count: 267 I/O pins provide flexibility to connect numerous peripherals and buses directly to the FPGA.
• Flexible Power Options: Support for 1.14 V to 2.625 V simplifies integration with a range of board power rails and I/O standards.
• Compact BGA Footprint: 484-FPBGA (23×23) package enables high-density board layouts while remaining surface-mount compatible.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C and RoHS compliant for commercial product deployments.

Why Choose M2GL060TS-1FGG484?

The M2GL060TS-1FGG484 positions itself as a high-capacity IGLOO2 FPGA for commercial embedded designs that require significant logic resources, substantial on-chip memory, and a large number of I/O. Its combination of 56,520 logic elements, approximately 1.87 Mbits of embedded RAM, and 267 I/O in a compact 484-BGA surface-mount package makes it suitable for consolidating functions and reducing system-level component count.

This device is well suited to designers seeking a commercially graded, RoHS-compliant FPGA with flexible voltage support and a standard 0 °C to 85 °C operating range. It serves projects where board space, I/O density, and on-chip memory capacity are primary considerations.

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