M2GL060TS-1FGG676

The M2GL060TS-1FGG676 is an IGLOO2 Field Programmable Gate Array (FPGA) in a commercial-grade surface-mount package. It delivers a high logic capacity and on-chip memory with a substantial I/O count, suitable for a wide range of FPGA-based designs within the integrated circuits category.

Key hardware attributes include 56,520 logic elements, approximately 1.87 Mbits of embedded memory, 387 I/O, a 676-ball BGA package, and a supply voltage range of 1.14 V to 2.625 V, making it appropriate for commercial electronic applications requiring dense logic and I/O integration.

Key Features

• Core Capacity  56,520 logic elements provide considerable programmable logic resources for complex digital designs.
• Embedded Memory  Approximately 1.87 Mbits of on-chip RAM for buffering, FIFOs, and local storage of intermediate data.
• I/O Density  387 I/O pins to support multiple interfaces and high pin-count connectivity requirements.
• Power Supply Range  Supports a voltage supply range of 1.14 V to 2.625 V to match diverse system power rails.
• Package and Mounting  Delivered in a 676-ball BGA package (Supplier device package: 676-FBGA (27x27)) optimized for surface-mount assembly.
• Commercial Grade & Temperature  Grade: Commercial with an operating temperature range of 0 °C to 85 °C for standard commercial environments.
• Environmental Compliance  RoHS compliant to support regulatory requirements for lead-free assemblies.

Typical Applications

• I/O‑intensive systems  Designs that require extensive external connectivity can leverage the 387 I/O pins for multiple parallel interfaces and signal routing.
• Logic‑dense implementations  Applications needing significant programmable logic can make use of the 56,520 logic elements for custom datapaths and control logic.
• Memory‑centric functions  Use cases that require on-chip temporary storage benefit from approximately 1.87 Mbits of embedded memory for buffering and local data handling.
• Compact board designs  High pin count in a 676-BGA package supports dense, space-constrained PCB layouts while maintaining surface-mount compatibility.

Unique Advantages

• Large programmable capacity: 56,520 logic elements enable substantial custom logic integration without external programmable devices.
• Significant embedded memory: Approximately 1.87 Mbits of on-chip RAM reduces reliance on external memory for intermediate storage and streaming data tasks.
• High I/O count: 387 I/O pins provide flexibility for multiple interfaces, sensor arrays, and parallel data paths.
• Flexible power support: A wide supply voltage range (1.14 V to 2.625 V) accommodates varied system power architectures.
• Surface-mount BGA packaging: 676-ball BGA (676-FBGA (27x27)) offers a compact, high-pin-count solution for dense PCB designs.
• Commercial readiness: Commercial grade operation (0 °C to 85 °C) and RoHS compliance align with standard electronic product requirements.

Why Choose M2GL060TS-1FGG676?

The M2GL060TS-1FGG676 positions itself as a commercial-grade IGLOO2 FPGA option for designers who need a balance of high logic density, embedded memory, and extensive I/O in a compact surface-mount package. Its combination of 56,520 logic elements, approximately 1.87 Mbits of on-chip RAM, and 387 I/O makes it suitable for FPGA-based designs that require integrated digital resources and flexible connectivity.

For teams focused on scalable, reliable commercial electronic designs, this part offers a clear hardware foundation to consolidate logic, memory, and I/O requirements into a single FPGA device while meeting RoHS environmental standards.

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