M2GL060TS-1VF400

The M2GL060TS-1VF400 is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a large pool of configurable logic elements, on-chip embedded memory, and a substantial I/O count in a compact 400‑ball LFBGA package for commercial electronic designs.

This device is appropriate for designs that require high logic capacity, embedded memory, and flexible I/O while operating within a commercial temperature range and a wide supply voltage window.

Key Features

• Logic Capacity — 56,520 logic elements (cells) available for implementing custom digital logic and state machines.
• Embedded Memory — Approximately 1.87 Mbits of embedded memory (1,869,824 bits) for buffering, FIFOs, and data storage on-chip.
• I/O Count — 207 I/O pins to support multiple peripheral interfaces and board-level connectivity.
• Power Supply Range — Operates from 1.14 V to 2.625 V, accommodating a range of core and I/O voltage architectures.
• Package & Mounting — Surface mount 400‑LFBGA package; supplier device package listed as 400‑VFBGA (17×17) for compact PCB integration.
• Operating Temperature & Grade — Commercial grade device rated for 0 °C to 85 °C operation.
• Compliance — RoHS compliant.

Typical Applications

• Embedded Systems — Leverage the 56,520 logic elements and on-chip memory for custom control logic, peripheral integration, and protocol handling in embedded designs.
• Interface and Bridging — Use the 207 I/Os to implement parallel or serial interface bridging and glue logic between subsystems.
• Data Buffering and Processing — On-chip memory (approximately 1.87 Mbits) supports data buffering, small FIFOs, and lookup tables for real-time data handling.

Unique Advantages

• High Logic Density: 56,520 logic elements allow complex digital functions to be implemented on a single device, reducing board-level component count.
• On-Chip Memory: Approximately 1.87 Mbits of embedded RAM minimizes external memory needs for many buffering and processing tasks.
• Robust I/O Capability: 207 I/Os provide flexibility to connect multiple peripherals or subsystems without additional interface chips.
• Flexible Power Integration: Broad supply voltage range (1.14 V–2.625 V) supports integration with various power domains.
• Compact Surface-Mount Package: 400‑LFBGA (400‑VFBGA, 17×17) enables dense PCB layouts while maintaining a large logic and I/O count.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for standard commercial applications.

Why Choose M2GL060TS-1VF400?

The M2GL060TS-1VF400 positions itself as a high‑capacity, commercially graded FPGA option for designs that require substantial programmable logic, embedded memory, and broad I/O connectivity in a compact surface-mount package. Its combination of 56,520 logic elements, approximately 1.87 Mbits of on-chip RAM, and 207 I/Os offers designers the integration needed to simplify board-level architectures and reduce external components.

This IGLOO2 device is suitable for teams building scalable, configurable digital systems who need predictable commercial-temperature operation and a flexible power-supply window. Documentation from the manufacturer is available to support integration and product deployment.

Request a quote or submit an inquiry to receive pricing and availability for the M2GL060TS-1VF400.