M2GL060TS-1FGG676T2
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 387 1869824 56520 676-BGA |
|---|---|
| Quantity | 1,389 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Automotive | Operating Temperature | -40°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 387 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56520 | Number of Logic Elements/Cells | 56520 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | AEC-Q100 | Total RAM Bits | 1869824 |
Overview of M2GL060TS-1FGG676T2 – IGLOO2 FPGA, 56,520 Logic Elements, 676‑BGA
The M2GL060TS-1FGG676T2 is an IGLOO2 family Field Programmable Gate Array (FPGA) from Microchip Technology. It combines fourth‑generation flash‑based FPGA fabric with high‑performance communications and memory interfaces to support complex embedded logic, DSP and high‑speed I/O tasks.
Targeted at applications requiring high integration and robust environmental performance, this device delivers 56,520 logic elements, approximately 1.87 Mbits of embedded memory, 387 user I/Os and automotive AEC‑Q100 qualification in a 676‑ball FBGA (27 × 27 mm) package.
Key Features
- Core Architecture Flash‑based IGLOO2 FPGA fabric with 56,520 logic elements for implementing complex logic and control functions.
- Embedded Memory Approximately 1.87 Mbits of on‑chip RAM capacity for frame buffers, FIFOs and application data storage.
- DSP and Math Resources IGLOO2 family mathblocks and DSP resources support signed/unsigned multiplications and accumulation for signal processing tasks.
- High‑Speed Serial Interfaces Series‑level support for up to 16 SERDES lanes and PCI Express lane configurations enables high‑bandwidth serial connectivity.
- High‑Speed Memory Controllers Family support for DDRx memory controllers (LPDDR/DDR2/DDR3) and SDRAM soft controllers provides options for external memory interfacing.
- User I/O and Standards 387 user I/Os supporting multiple standards (including LVDS and various DDR I/O standards) to interface with sensors, transceivers and peripherals.
- Power and Voltage Flexible supply range from 1.14 V to 2.625 V to accommodate system core and I/O power architectures.
- Package and Mounting 676‑ball FBGA package (27 × 27 mm) with surface mount construction for compact system integration.
- Automotive Qualification and Temperature Range AEC‑Q100 qualification and an operating temperature range of −40 °C to 125 °C for automotive and harsh environment deployment.
- Compliance RoHS compliant for environmental and regulatory adherence.
Typical Applications
- Automotive Systems Suitable for automotive‑grade controller designs and high‑reliability subsystems where AEC‑Q100 qualification and wide temperature range are required.
- Communications & Networking High‑speed SERDES lanes and PCIe support make the device appropriate for network interface, protocol bridging and packet processing implementations.
- Industrial Control Dense logic and embedded memory support motor control, motion profiling and deterministic control logic in industrial automation equipment.
- Embedded Signal Processing On‑chip DSP mathblocks and sizeable embedded RAM enable filtering, data aggregation and real‑time signal processing tasks.
Unique Advantages
- Automotive‑grade qualification: AEC‑Q100 qualification and −40 °C to 125 °C rating allow use in temperature‑challenging and safety‑critical environments.
- High integration density: 56,520 logic elements and substantial embedded RAM reduce external component count and simplify board design.
- Flexible I/O and interfaces: 387 user I/Os and family support for SERDES, PCIe and DDR memory interfaces enable a wide range of system architectures.
- Compact package: 676‑FBGA (27 × 27 mm) provides a dense, surface‑mount footprint for space‑constrained applications.
- Regulatory compliance: RoHS compliance supports use in modern manufacturing and supply chains.
Why Choose M2GL060TS-1FGG676T2?
The M2GL060TS-1FGG676T2 delivers a balance of high logic density, embedded memory and robust I/O in an automotive‑qualified IGLOO2 FPGA platform. Its flash‑based fabric and series‑level interfaces make it a practical choice for designers who need integrated DSP capability, high‑speed serial links and support for external DDR memory within a compact BGA footprint.
This device is well suited to engineering teams building automotive, industrial and communications systems that require proven FPGA functionality, wide operating temperature range and supply‑chain compliance for long‑life deployments.
If you would like pricing, lead‑time information or help configuring this part for your design, request a quote or submit an inquiry to our sales team.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
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