M2GL060TS-1FGG676I

The M2GL060TS-1FGG676I is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a high-density programmable logic fabric with integrated on-chip RAM and a large number of I/O, designed for industrial applications.

With 56,520 logic elements, approximately 1.87 Mbits of embedded memory, and 387 I/O, this device targets designs that need significant programmable logic capacity, substantial local memory, and extensive external connectivity while operating across a wide industrial temperature range.

Key Features

• Logic Capacity  56,520 logic elements for implementing complex digital logic and custom processing pipelines.
• Embedded Memory  Approximately 1.87 Mbits of on-chip RAM to support data buffering, state storage, and local scratchpad requirements.
• I/O Density  387 I/O pins to enable broad external interfacing and parallel connectivity for sensors, peripherals, and external buses.
• Supply Voltage Range  Flexible voltage support from 1.14 V to 2.625 V to accommodate varied system power architectures.
• Package and Mounting  676-FBGA (27 × 27 mm) package in a surface-mount form factor for compact board integration.
• Operating Temperature  Rated for industrial use from −40 °C to 100 °C for reliable operation in harsh environments.
• RoHS Compliance  RoHS-compliant material status for regulatory and production readiness.

Typical Applications

• Industrial Control and Automation  High logic density and broad I/O support enable control, sequencing, and sensor interfacing in factory and process automation systems operating across industrial temperatures.
• Data Acquisition and Signal Processing  On-chip RAM and large logic resources support buffering, real-time preprocessing, and custom data-path implementations.
• Communications and Interface Bridging  Extensive I/O count allows implementation of protocol bridging and parallel interfaces between subsystems.

Unique Advantages

• High Logic Integration: 56,520 logic elements provide room for complex custom logic without relying on multiple discrete devices, simplifying board design.
• Significant On-Chip Memory: Approximately 1.87 Mbits of embedded RAM supports local data buffering and reduces external memory dependency.
• Extensive I/O Capability: 387 I/O pins accommodate dense peripheral connectivity and parallel interfaces, enabling flexible system integration.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in temperature-challenging environments common to industrial applications.
• Compact BGA Package: 676-FBGA (27 × 27 mm) surface-mount package delivers high pin count in a board-space-efficient footprint.
• Flexible Power Options: Broad supply voltage range (1.14 V to 2.625 V) for compatibility with varied system power rails.

Why Choose M2GL060TS-1FGG676I?

The M2GL060TS-1FGG676I combines substantial logic capacity, significant embedded RAM, and a high I/O count in a compact 676-FBGA package, positioned for industrial applications that require robust programmable logic and broad connectivity. Its supported supply voltage range and industrial temperature rating make it suitable for designs that must balance density, flexibility, and environmental resilience.

This device is appropriate for development teams and procurement looking for a highly integrated FPGA solution for control, interfacing, and data-handling tasks where on-chip resources and wide operating temperature support reduce system complexity and help future-proof designs.

Request a quote or submit a procurement inquiry to receive pricing and availability for the M2GL060TS-1FGG676I.