M2GL060TS-1FG676

The M2GL060TS-1FG676 is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology in a 676-ball BGA package. It provides a mid-to-high density programmable logic fabric in a commercial-grade, surface-mount package for embedded and system-level designs.

Key on-chip resources include 56,520 logic elements, approximately 1.87 Mbits of embedded memory, and 387 user I/O pins. The device supports supply voltages from 1.14 V to 2.625 V and operates across a commercial temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity — 56,520 logic elements for implementing complex custom logic, datapaths and control functions.
• Embedded Memory — Approximately 1.87 Mbits of on-chip RAM to support buffering, state storage and small local memories.
• I/O Resources — 387 user I/O pins to accommodate diverse peripheral and interface needs in a single device.
• Power Supply Flexibility — Operates from 1.14 V to 2.625 V to match a range of system voltage domains.
• Package and Mounting — 676-FBGA (27×27 mm) surface-mount package for compact board integration and high pin-count routing.
• Commercial Grade — Rated for 0 °C to 85 °C operation for standard commercial environments.
• RoHS Compliant — Meets RoHS environmental requirements.

Typical Applications

• Commercial Embedded Systems — Implement custom control logic, glue logic and protocol converters where reconfigurable capability is needed.
• Communication Interfaces — Provide flexible I/O and programmable logic to support custom interface adaptation and signal management.
• Prototyping and Development — Use the FPGA’s logic and memory resources for rapid hardware prototyping and iterative design validation.

Unique Advantages

• High Logic Density: 56,520 logic elements enable substantial on-chip implementation of complex digital functions without immediate need for external logic.
• Significant On-Chip Memory: Approximately 1.87 Mbits of embedded RAM reduces dependence on external memory for many buffering and state storage tasks.
• Extensive I/O Count: 387 user I/Os allow broad connectivity to peripherals, sensors and interface components from a single device.
• Flexible Powering: Wide supply range (1.14 V to 2.625 V) supports integration into a variety of system power architectures.
• Compact, High-Pin-Count Package: 676-FBGA (27×27) surface-mount package balances high I/O availability with a compact PCB footprint.
• Commercial Temperature Range: Rated 0 °C to 85 °C for deployment in standard commercial operating environments.

Why Choose M2GL060TS-1FG676?

The M2GL060TS-1FG676 positions itself as a capable IGLOO2 FPGA option for commercial embedded designs that require a combination of substantial logic capacity, on-chip memory and a high number of I/O signals in a compact BGA package. Its supply voltage flexibility and RoHS compliance make it suitable for a wide range of standard commercial system architectures.

Designers seeking a reconfigurable device that can consolidate multiple digital functions, support prototyping workflows, or reduce external component count will find the M2GL060TS-1FG676 aligned with those objectives while benefiting from Microchip Technology’s product support and ecosystem.

Request a quote or submit an inquiry to start the procurement process for M2GL060TS-1FG676 and evaluate fit for your next design.