M2GL060TS-1FCSG325I

The M2GL060TS-1FCSG325I is an IGLOO2 FPGA device providing reconfigurable logic and on-chip embedded memory in a compact BGA package. It delivers 56,520 logic elements and approximately 1.87 Mbits of embedded RAM, along with up to 200 general-purpose I/O pins.

Designed for surface-mount placement and rated for industrial use, the device supports a broad supply range and a wide operating temperature span for deployment in temperature-critical embedded systems.

Key Features

• Logic Capacity — 56,520 logic elements for implementing custom digital functions and interfaces.
• Embedded Memory — Approximately 1.87 Mbits of on-chip RAM to support FIFOs, buffers, and local storage for logic blocks.
• I/O — Up to 200 I/O pins to connect with external peripherals, sensors, and buses.
• Power Supply — Flexible supply voltage range from 1.14 V to 2.625 V to accommodate various I/O and core voltage requirements.
• Package & Mounting — 325‑TFBGA package (supplier device package: 325‑FCBGA, 11×11) in a surface-mount form factor for space-efficient board designs.
• Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for reliable operation in demanding environments.
• Compliance — RoHS compliant for reduced hazardous substance content in production and assemblies.

Typical Applications

• Industrial Control — Implement custom control logic, motor control interfaces, and sensor aggregation with the device’s logic capacity and 200 I/O.
• Embedded System Glue Logic — Replace multiple discrete components by consolidating interface and timing functions within the FPGA’s programmable fabric.
• Communications & Protocol Bridge — Use on-chip RAM and abundant I/O to buffer and translate between peripheral interfaces and system buses.

Unique Advantages

• High Logic Density: 56,520 logic elements provide significant capacity for complex control and interface designs, reducing the need for additional ASICs or CPLDs.
• On-Chip Memory Availability: Approximately 1.87 Mbits of embedded RAM supports local buffering and state storage, simplifying system memory architecture.
• Generous I/O Count: Up to 200 I/O pins enable broad connectivity to peripherals, sensors, and external devices without extensive external glue logic.
• Wide Supply Range: 1.14 V to 2.625 V support helps accommodate different signaling standards and power domains on the same board.
• Industrial Temperature Rating: −40 °C to 100 °C operating range suits deployments in environments with extended temperature requirements.
• Compact Surface-Mount BGA: 325‑TFBGA / 325‑FCBGA (11×11) package balances high pin count with a small PCB footprint for space-constrained designs.

Why Choose M2GL060TS-1FCSG325I?

The M2GL060TS-1FCSG325I positions itself as a versatile IGLOO2 FPGA option for designs that require substantial programmable logic, embedded memory, and a high I/O count in an industrial-grade package. Its combination of logic capacity, approximately 1.87 Mbits of on-chip RAM, and a flexible supply range make it suitable for integrators seeking to consolidate functions and simplify board-level design.

Engineers and procurement teams will find long-term value in the device’s robust operating temperature range, surface-mount BGA footprint, and RoHS compliance, enabling reliable deployment across a variety of industrial and embedded applications.

Request a quote or submit a sales inquiry to obtain pricing, availability, and assistance integrating the M2GL060TS-1FCSG325I into your next design.