M2GL060TS-1FCS325

The M2GL060TS-1FCS325 is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology, supplied in a 325‑TFBGA (325‑FCBGA, 11×11) surface‑mount package. It provides a balanced combination of logic capacity, embedded memory, and a broad I/O count suitable for configurable digital designs.

With a wide core voltage operating range and commercial temperature grading, this device targets applications that require programmable logic resources and flexible I/O in a compact BGA footprint.

Key Features

• Device family IGLOO2 Field Programmable Gate Array from Microchip Technology, offering programmable logic in a compact BGA package.
• Logic capacity 56,520 logic elements for implementing custom digital logic and state machines.
• Embedded memory Approximately 1.87 Mbits of on‑chip RAM to support buffers, FIFOs, and local data storage.
• I/O resources 200 user I/O pins to support multiple interfaces and peripheral connections.
• Power supply Operates across a core/signal voltage range of 1.14 V to 2.625 V, enabling designs with various voltage domains.
• Package and mounting 325‑TFBGA / 325‑FCBGA (11×11) surface‑mount package for space‑efficient PCB implementations.
• Temperature and grade Commercial grade with an operating range of 0°C to 85°C for standard environment deployments.
• Compliance RoHS compliant.

Typical Applications

• Custom digital logic Use the 56,520 logic elements to implement tailored datapaths, state machines, and control logic.
• I/O bridging and protocol conversion Leverage 200 user I/Os to interface between multiple peripherals, buses, or I/O standards.
• On‑board buffering and local memory Utilize approximately 1.87 Mbits of embedded RAM for FIFOs, packet buffering, and temporary storage.

Unique Advantages

• High logic density: 56,520 logic elements enable complex logic implementations without external programmable logic chips.
• Integrated embedded memory: Approximately 1.87 Mbits of on‑chip RAM reduces the need for external memory in many control and buffering tasks.
• Generous I/O count: 200 user I/Os provide flexibility for multi‑interface designs and peripheral expansion.
• Flexible supply range: Support for 1.14 V to 2.625 V operation allows integration with varied voltage domains.
• Compact BGA package: 325‑TFBGA / 325‑FCBGA (11×11) package saves board area while supporting surface‑mount assembly.
• RoHS compliant: Environmentally compliant manufacturing and disposal attributes.

Why Choose M2GL060TS-1FCS325?

The M2GL060TS-1FCS325 positions itself as a versatile IGLOO2 FPGA option for designs that require substantial programmable logic, meaningful on‑chip RAM, and a high I/O count in a compact 325‑BGA package. Its voltage flexibility and commercial temperature rating make it suitable for a wide range of standard embedded and digital designs.

Backed by Microchip Technology, this device is appropriate for engineers seeking a balance of logic capacity, embedded memory, and I/O flexibility while maintaining a small board footprint and RoHS compliance.

Request a quote or submit a pricing request today to get lead‑time and availability for the M2GL060TS-1FCS325.