M2GL060TS-1FCSG325

The M2GL060TS-1FCSG325 is an IGLOO2 Field Programmable Gate Array from Microchip Technology designed for compact, surface-mount system designs. It provides 56,520 logic elements, approximately 1.87 Mbits of embedded memory, and 200 user I/O pins in a 325-TFBGA (325‑FCBGA, 11×11) package.

With a supply voltage range of 1.14 V to 2.625 V and a commercial operating temperature range of 0 °C to 85 °C, this device targets mainstream embedded and electronic designs that require significant logic capacity and on-chip RAM in a compact BGA footprint.

Key Features

• Core Logic 56,520 logic elements to implement complex custom logic, state machines, and control functions.
• On‑Chip Memory Approximately 1.87 Mbits of embedded RAM for buffers, FIFOs, and memory‑intensive functions.
• I/O Capability 200 user I/O pins to support multiple interfaces, parallel buses, and extensive signal routing.
• Power Flexible supply voltage range from 1.14 V to 2.625 V to support diverse power architectures and I/O signaling options.
• Package & Mounting 325‑TFBGA / 325‑FCBGA (11×11) surface‑mount package for high‑density board integration.
• Temperature & Grade Commercial grade device rated for 0 °C to 85 °C operating temperature.
• Compliance RoHS‑compliant to support regulatory and environmental requirements.

Typical Applications

• Custom Logic and Control — Use the device's 56,520 logic elements to implement application‑specific state machines and control logic in embedded systems.
• Data Buffering and Memory‑Intensive Tasks — Approximately 1.87 Mbits of on‑chip RAM supports buffering, packet staging, and temporary data storage.
• I/O Bridging and Interface Aggregation — 200 user I/O pins enable aggregation of multiple peripheral interfaces and signal conversion on a single FPGA.

Unique Advantages

• High Logic Density: 56,520 logic elements provide substantial capacity for complex designs while keeping board count low.
• Significant Embedded Memory: Approximately 1.87 Mbits of on‑chip RAM reduces dependence on external memory for many buffering and processing tasks.
• Generous I/O Count: 200 user I/O pins facilitate integration of multiple peripherals and flexible system interfaces.
• Compact BGA Package: 325‑TFBGA / 325‑FCBGA (11×11) offers a space-efficient form factor for high-density PCBs.
• Broad Supply Range: 1.14 V to 2.625 V supply flexibility supports different power domains and design architectures.
• RoHS Compliant: Meets environmental compliance expectations for commercial electronic products.

Why Choose M2GL060TS-1FCSG325?

The M2GL060TS-1FCSG325 balances substantial logic capacity, embedded memory, and a high I/O count in a compact 325‑TFBGA/FCBGA package, making it suitable for commercial embedded designs that require on‑board programmable logic without sacrificing board real estate. Its wide supply voltage window and RoHS compliance provide flexibility for a range of system power architectures and environmental requirements.

This FPGA is well suited to engineers and procurement teams building mid‑to‑high complexity electronic systems that benefit from integrated logic and memory resources, compact packaging, and clear commercial‑grade operating limits.

Request a quote or submit an inquiry to sales to discuss pricing, availability, and how the M2GL060TS-1FCSG325 can fit into your next design.