M2GL060TS-1FCS325I

The M2GL060TS-1FCS325I is an IGLOO2 Field Programmable Gate Array (FPGA) provided in a 325-TFBGA surface-mount package. It integrates 56,520 logic elements and approximately 1.87 Mbits of embedded memory, and exposes up to 200 general-purpose I/Os for system integration.

Engineered for industrial environments, this device supports a wide supply voltage range (1.14 V to 2.625 V) and operates across a -40°C to 100°C temperature range, offering a combination of integration and environmental robustness for embedded and industrial designs.

Key Features

• Logic Capacity  56,520 logic elements provide substantial on-chip programmable logic resources for implementing custom digital functions.
• Embedded Memory  Approximately 1.87 Mbits of on-chip RAM to support data buffering, state storage, and small-memory functions without external SDRAM.
• I/O Count  Up to 200 general-purpose I/Os to interface with sensors, peripherals, memory devices, and other system components.
• Power Supply Range  Operates from 1.14 V to 2.625 V, enabling compatibility with a variety of system power domains and signaling requirements.
• Package and Mounting  325-TFBGA (325-FCBGA, 11×11) surface-mount package for compact board-level integration.
• Industrial Temperature Grade  Rated for -40°C to 100°C operation to meet industrial thermal requirements.
• RoHS Compliant  Manufactured to meet RoHS environmental compliance requirements.

Typical Applications

• Industrial Control and Automation  The industrial temperature range and 200 I/Os make the device suitable for embedded controllers, I/O aggregation, and machine control tasks.
• Embedded Systems  On-chip logic and embedded memory allow consolidation of glue logic, peripherals, and custom interfaces in compact embedded designs.
• Communications and I/O Interfaces  A high I/O count supports protocol bridging, custom interface logic, and peripheral aggregation for communications equipment.

Unique Advantages

• High Integration  Large logic element count and on-chip memory reduce the need for external glue logic and discrete components.
• Flexible I/O  Up to 200 I/Os enable extensive device interfacing without additional I/O expanders.
• Wide Power Compatibility  Support for 1.14 V to 2.625 V supplies eases integration into diverse system power architectures.
• Industrial Robustness  A -40°C to 100°C operating range addresses demanding thermal environments common in industrial applications.
• Compact Board Footprint  325-TFBGA surface-mount package provides a balance of pin count and compact PCB area.

Why Choose M2GL060TS-1FCS325I?

The M2GL060TS-1FCS325I positions itself as a capable IGLOO2 FPGA option for designs that require substantial programmable logic, embedded memory, and a high I/O count in a compact surface-mount package. Its industrial-grade temperature rating and broad supply voltage window make it suitable for embedded and industrial applications that demand reliable operation across varied conditions.

Design teams seeking to consolidate logic, implement custom interfaces, or reduce board-level component count will find the device's combination of logic resources, memory, and I/O flexibility beneficial for long-term scalability and robust system integration.

Request a quote or contact sales to discuss pricing, availability, and how the M2GL060TS-1FCS325I can fit your next design.