M2GL060T-VFG784I

M2GL060T-VFG784I
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 1869824 56520 784-FBGA

Quantity 410 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package784-VFBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case784-FBGANumber of I/ON/AVoltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs56520Number of Logic Elements/Cells56520
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1869824

Overview of M2GL060T-VFG784I – IGLOO2 FPGA, 56,520 logic elements

The M2GL060T-VFG784I is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology designed for industrial-grade embedded and communications applications. This device integrates a 4-input LUT-based FPGA fabric with dedicated math blocks, multiple embedded memory blocks and on-chip nonvolatile flash memory technologies as described in the IGLOO2 family documentation.

With 56,520 logic elements and approximately 1.87 Mbits of on-chip RAM, the M2GL060T-VFG784I targets designs that require significant programmable logic capacity, reliable operation over a wide temperature range and a compact 784-ball FBGA package for space-constrained boards.

Key Features

  • Logic Capacity — 56,520 logic elements (LEs) for implementing medium- to high-density programmable logic and custom accelerators.
  • Embedded Memory — Approximately 1.87 Mbits of on-chip RAM to support buffering, state machines and intermediate data storage without immediate external memory dependency.
  • IGLOO2 FPGA Fabric — Industry-standard 4-input LUT-based fabric with integrated math blocks and multiple embedded memory blocks as described for the IGLOO2 family.
  • On-Chip Nonvolatile and SRAM — IGLOO2 family integration includes on-chip flash and embedded SRAM resources for configuration and runtime storage.
  • I/O and High-Speed Interfaces (Family Capability) — The IGLOO2 family documentation cites high-performance SerDes lanes and memory interface capabilities; use these family capabilities where applicable in system design.
  • Package — 784-FBGA (supplier device package: 784-VFBGA, 23×23) optimized for high-density board layouts.
  • Power — Core supply range 1.14 V to 1.26 V for power budgeting and regulator selection.
  • Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
  • Mounting — Surface-mount device suitable for modern PCB assembly processes.
  • RoHS Compliant — Conforms to RoHS environmental requirements.

Typical Applications

  • Industrial Control — Implement motor control, motion sequencing and custom I/O processing using the device’s programmable logic and embedded memory while benefiting from the −40 °C to 100 °C rating.
  • Communications Infrastructure — Use the IGLOO2 family’s high-performance SerDes and memory interface capabilities for protocol bridging and packet processing in networking equipment.
  • Embedded Processing and Acceleration — Offload compute-intensive tasks to integrated math blocks and custom logic implemented across 56,520 logic elements.
  • Secure, Low-Power Systems — Leverage the family’s low-power flash technology and on-chip nonvolatile storage for secure configuration and reduced BOM in energy-conscious designs.

Unique Advantages

  • Substantial Logic Density: 56,520 logic elements provide the capacity to implement complex state machines, datapaths and hardware accelerators without immediate external FPGA resources.
  • Embedded Memory Resources: Approximately 1.87 Mbits of on-chip RAM reduce dependency on external memory for many buffering and scratchpad needs, simplifying system architecture.
  • Industrial Reliability: −40 °C to 100 °C operating range and industrial grade classification support deployment in harsh and temperature-variable environments.
  • Compact, High-Density Package: The 784-FBGA (23×23) package delivers high I/O density in a compact footprint for space-constrained PCBs.
  • Tight Power Envelope: A defined core supply range (1.14 V to 1.26 V) simplifies power-supply design and helps with predictable power budgeting.
  • Family-Level Integration: IGLOO2 family features—integrated LUT fabric, math blocks, on-chip flash and embedded SRAM—enable tightly integrated system designs and reduced external BOM.

Why Choose M2GL060T-VFG784I?

The M2GL060T-VFG784I brings a balanced mix of programmable logic capacity, embedded memory and rugged industrial specifications suited for demanding embedded and communications applications. Its 56,520 logic elements and approximately 1.87 Mbits of on-chip RAM allow designers to implement complex functions on-chip while the IGLOO2 family’s integrated architecture supports compact, low-power system designs.

This device is well suited to engineering teams and procurement groups building industrial controls, networking equipment and embedded accelerators that require a reliable, factory-tested FPGA in a high-density FBGA package with defined power and thermal characteristics.

Request a quote or submit an inquiry for pricing and availability for the M2GL060T-VFG784I today.

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