M2GL150-FC1152I

The M2GL150-FC1152I is an IGLOO2 Field Programmable Gate Array (FPGA) designed for industrial embedded systems requiring high logic density, significant on-chip memory, and large I/O capability. With 146,124 logic elements and approximately 5.12 Mbits of embedded memory, this device targets designs that need substantial programmable logic and buffering inside a single, surface-mount FCBGA package.

Key attributes include a wide supply voltage range and an industrial operating temperature rating, making the device suitable for applications that demand robust operation across varying environments and reliable I/O connectivity.

Key Features

• Logic Capacity 146,124 logic elements provide substantial programmable logic resources for implementing complex state machines, datapaths, and custom accelerators.
• Embedded Memory Approximately 5.12 Mbits of on-chip RAM for buffering, queues, and local data storage without external memory.
• I/O Density 574 I/O pins support extensive peripheral, sensor, and interface connectivity within a single device.
• Power and Voltage Supported supply voltage range from 1.14 V to 2.625 V allowing flexibility in board-level rail design.
• Package and Mounting 1152-FCBGA package (35×35 mm) / 1152-BBGA, surface-mount for high-density board integration.
• Temperature Range Industrial-grade operation from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Regulatory RoHS compliant.

Typical Applications

• Industrial Control High logic capacity and industrial temperature rating support complex control algorithms, I/O aggregation, and sensor/actuator interfacing in factory automation and process control equipment.
• Protocol Bridging and Data Interfaces Large I/O count and embedded memory enable implementation of protocol converters, interface bridges, and real-time data handling between subsystems.
• Instrumentation and Test Equipment On-chip RAM and dense logic resources allow implementation of data capture, preprocessing, and custom measurement logic within compact instrument designs.

Unique Advantages

• High Logic Integration: 146,124 logic elements consolidate complex digital functions into a single FPGA, reducing the need for multiple discrete devices.
• Substantial On‑Chip Memory: Approximately 5.12 Mbits of embedded RAM lowers dependency on external memory for buffering and temporary storage.
• Extensive I/O: 574 I/O pins provide broad connectivity for multi-channel interfaces, sensors, and peripheral expansion without additional bridge chips.
• Industrial Temperature Range: Rated for −40 °C to 100 °C to support reliable operation in demanding environmental conditions.
• Flexible Powering: Wide supply voltage range (1.14 V–2.625 V) accommodates diverse board power architectures and interfacing requirements.
• Compact, Surface‑Mount FCBGA: 1152-FCBGA (35×35 mm) package enables high-density PCB layouts while keeping components surface-mount for automated assembly.

Why Choose M2GL150-FC1152I?

The M2GL150-FC1152I offers a blend of high logic density, meaningful on-chip memory, and a very large I/O count packaged for surface-mount assembly and rated for industrial temperatures. Its combination of resources is suited to engineers building complex embedded systems that require integrated logic, substantial local memory, and broad connectivity in a single FPGA device.

Choose this IGLOO2 device when your design priorities include consolidating functionality, maintaining operation across an extended temperature range, and simplifying board-level integration with a high-pin-count FCBGA package.

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