M2GL150T-1FC1152M

The M2GL150T-1FC1152M is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology, supplied in a 1152-FCBGA package. Designed for military-grade, high-reliability embedded systems, it delivers a large logic capacity, substantial on-chip memory, and extensive I/O in a compact surface-mount BGA footprint.

Key Features

• Logic Capacity 146,124 logic elements for complex custom logic and high-density design implementations.
• Embedded Memory Approximately 5.12 Mbits of on-chip RAM to support buffering, data processing, and state storage.
• I/O Density 574 I/O pins to enable broad peripheral and subsystem connectivity within a single device.
• Power and Supply Flexibility Operates across a 1.14 V to 2.625 V supply range to accommodate varied system power architectures.
• Military Qualification & Temperature Range Qualified to MIL-STD-883 and rated for operation from −55 °C to 125 °C for deployment in demanding environments.
• Package & Mounting 1152-FCBGA (35×35) package, surface-mount BGA footprint for space-efficient board designs.
• Regulatory Compliance RoHS compliant.

Typical Applications

• Defense and Military Systems — Military-grade qualification and extended temperature range make this FPGA suitable for mission-critical control, signal processing, and telemetry functions.
• Avionics and Ruggedized Electronics — High logic density, substantial embedded memory, and broad I/O support complex avionics interfaces and real-time processing under harsh thermal conditions.
• High‑Density Embedded Control — Large logic element count and many I/Os enable integration of multiple control and interface functions into a single FPGA to reduce system complexity.

Unique Advantages

• High logic integration: 146,124 logic elements provide the capacity to consolidate extensive custom logic into one device, reducing BOM and board-level routing.
• Significant on‑chip memory: Approximately 5.12 Mbits of embedded RAM supports data buffering and memory‑intensive processing without external memory.
• Extensive connectivity: 574 I/Os allow flexible interfacing to sensors, data busses, and peripherals without adding external glue logic.
• Designed for harsh environments: MIL‑STD‑883 qualification and −55 °C to 125 °C operating range support reliable operation in temperature‑extreme deployments.
• Flexible power integration: Wide supply range (1.14 V to 2.625 V) aids integration into diverse power domains and modern system architectures.
• Compact system footprint: 1152‑FCBGA packaging enables a high‑performance FPGA solution in a space‑efficient surface‑mount form factor.

Why Choose M2GL150T-1FC1152M?

The M2GL150T-1FC1152M positions itself as a high-capacity, reliable FPGA option for designs that demand military qualification, wide temperature tolerance, and significant logic and memory resources. Its combination of 146,124 logic elements, approximately 5.12 Mbits of embedded memory, and 574 I/Os supports consolidation of complex functions into a single device, simplifying system architecture and reducing component count.

This FPGA is ideal for engineers and program managers developing military, avionics, and other high-reliability embedded systems where qualification and environmental robustness are required. The device’s package, power flexibility, and RoHS compliance provide practical advantages for long-term deployment and manufacturability.

Request a quote or contact sales to discuss inventory, lead times, and integration support for the M2GL150T-1FC1152M.