M2GL150T-1FC1152

The M2GL150T-1FC1152 is an IGLOO2 field programmable gate array (FPGA) supplied in a 1152-FCBGA package. It delivers a large logic fabric and embedded memory suitable for commercial applications that require high I/O density and on-chip storage.

This device combines 146,124 logic elements with approximately 5.12 Mbits of embedded memory and 574 I/O pins, providing a compact platform for complex, memory‑intensive and I/O‑rich FPGA designs.

Key Features

• Logic Capacity  146,124 logic elements to implement sizable digital logic functions and custom datapaths.
• Embedded Memory  Approximately 5.12 Mbits of on‑chip RAM for buffering, FIFOs, and embedded storage requirements.
• I/O Density  574 available I/O pins to support extensive peripheral interfacing and multi‑channel connectivity.
• Power Supply Range  Operates across a supply voltage range of 1.14 V to 2.625 V to match a variety of system power rails.
• Package & Mounting  1152‑BBGA / 1152‑FCBGA surface‑mount package (1152‑FCBGA, 35×35) for compact board integration.
• Operating Grade & Temperature  Commercial grade device with an ambient operating range of 0 °C to 85 °C.
• RoHS Compliance  RoHS‑compliant construction to meet standard environmental and manufacturing requirements.

Typical Applications

• Communications and Networking  Implement protocol processing, packet buffering and multi‑lane I/O aggregation using the device's high logic and I/O capacity.
• Embedded Compute and Control  Ideal for building custom accelerators, controllers, and glue logic where on‑chip memory and logic density reduce external component count.
• Video and Imaging Systems  Use the abundant logic resources and embedded RAM for frame buffering, preprocessing, and parallel data paths.
• Industrial Automation (Commercial Grade)  Suitable for commercial automation systems that operate within the specified 0 °C to 85 °C range and benefit from extensive I/O.

Unique Advantages

• High logic capacity: 146,124 logic elements enable implementation of complex, multi‑module designs on a single device, reducing board-level partitioning.
• Substantial on‑chip memory: Approximately 5.12 Mbits of embedded RAM supports large buffers and state machines without relying on external memory.
• Extensive I/O count: 574 I/O pins provide flexibility for multi‑channel interfaces, sensor arrays, and parallel data lanes.
• Compact FCBGA packaging: The 1152‑FCBGA (35×35) package packs high density into a surface‑mount footprint for space‑constrained designs.
• Flexible voltage support: A supply range from 1.14 V to 2.625 V accommodates a variety of system power architectures.
• Commercial suitability and RoHS compliance: Designed for commercial applications with RoHS‑compliant construction to meet common manufacturing requirements.

Why Choose M2GL150T-1FC1152?

The M2GL150T-1FC1152 positions itself as a high‑capacity, memory‑rich FPGA solution for commercial designs that require substantial logic, on‑chip RAM, and a large number of I/Os in a compact FCBGA package. Its combination of 146,124 logic elements, approximately 5.12 Mbits of embedded memory, and 574 I/O pins supports complex, I/O‑intensive applications while minimizing external components.

With a wide supply voltage range and standard commercial operating temperature, this IGLOO2 device is suited for engineers building advanced communication, imaging, embedded compute, and commercial automation systems where integration density and on‑chip resources drive design efficiency.

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