M2GL150T-1FCG1152I

The M2GL150T-1FCG1152I is an IGLOO2 field programmable gate array (FPGA) from Microchip Technology, provided in a 1152-FCBGA (35×35) surface-mount package. It delivers a high logic density FPGA fabric combined with abundant I/O and embedded memory for industrial embedded applications.

With 146,124 logic elements, approximately 5.12 Mbits of embedded memory, and support for up to 574 I/Os, this device targets designs that require reconfigurable logic, large on-chip storage, and a broad I/O capability within an industrial temperature range.

Key Features

• Core Logic  146,124 logic elements provide high-density programmable logic for complex finite state machines, data-paths, and custom hardware acceleration.
• Embedded Memory  Approximately 5.12 Mbits of on-chip RAM enable local buffering, FIFOs, and memory-intensive logic functions without external memory.
• I/O Capacity  Up to 574 I/Os support dense peripheral interfacing, parallel buses, and mixed-signal front-end connectivity when paired with suitable transceivers.
• Power and Voltage  Supports a wide voltage supply range from 1.14 V to 2.625 V to accommodate various core and I/O supply architectures.
• Package and Mounting  Supplied in a 1152-FCBGA (35×35) package, designed for surface-mount PCB assembly in space-constrained, high-density systems.
• Temperature Range  Industrial operating range from −40°C to 100°C for deployment in demanding environments.
• Compliance  RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Industrial Control Systems  Use the device for programmable logic in motor control, factory automation, and process control where industrial-grade temperature performance is required.
• Embedded Processing  Implement custom accelerators, interfaces, and logic offload within embedded platforms that need significant on-chip memory and logic density.
• I/O-Intensive Systems  Ideal for applications that require many parallel signals or dense external device interfacing thanks to the 574 available I/Os.
• Communications and Infrastructure  Leverage the FPGA’s logic capacity and embedded memory for packet processing, protocol bridging, and custom data-path implementations.

Unique Advantages

• High Logic Density: 146,124 logic elements allow integration of complex logic and multiple functions into a single device, reducing system BOM and board area.
• Significant On-Chip Memory: Approximately 5.12 Mbits of embedded RAM reduce dependence on external memory and improve deterministic data handling.
• Extensive I/O Count: 574 I/Os provide flexibility for parallel interfaces, sensor arrays, and multi-channel connectivity without external I/O expanders.
• Industrial Temperature Rating: −40°C to 100°C operation supports deployment in harsh and temperature-variable environments.
• Flexible Power Options: Broad supply range (1.14 V to 2.625 V) enables compatibility with varied system power architectures.
• RoHS Compliant: Aligns with environmental regulations for assemblies and end products.

Why Choose M2GL150T-1FCG1152I?

The M2GL150T-1FCG1152I positions itself as an industrial-grade, high-density FPGA that balances logic capacity, embedded memory, and extensive I/O in a compact 1152-FCBGA package. Its specifications suit engineers designing embedded systems that need substantial programmable logic and on-chip storage while maintaining operation across a wide temperature range.

Backed by Microchip Technology, this IGLOO2 device is intended for designs where integration, deterministic on-chip memory, and a large I/O complement drive reductions in board complexity and component count, delivering a scalable platform for industrial and embedded projects.

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