M2GL150T-1FCG1152M

The M2GL150T-1FCG1152M is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology, offered in a 1152-ball FCBGA package. It delivers a high logic capacity and substantial embedded memory for demanding, high-reliability applications.

With MIL-STD-883 qualification, a wide operating temperature range and a broad I/O count, this device is targeted at military and other high-reliability embedded systems that require robust packaging, extensive I/O and on-chip memory capacity.

Key Features

• Logic Capacity — 146,124 logic elements for implementing complex digital designs and substantial logic integration.
• Embedded Memory — Approximately 5.12 Mbits of on-chip RAM to support data buffering, lookup tables and state storage.
• I/O Density — 574 I/O pins to accommodate broad peripheral interfacing and multi-channel connectivity.
• Package — 1152-FCBGA (35 × 35 mm) surface-mount package for high-density board integration.
• Supply Voltage Range — Operates from 1.14 V to 2.625 V, providing flexibility for different core and I/O voltage domains.
• Operating Temperature — Rated from −55 °C to 125 °C to support extended temperature deployments.
• Qualification & Grade — Military grade with MIL-STD-883 qualification for applications requiring established military test standards.

Typical Applications

• Military & Defense Systems — Use in mission-critical electronics where MIL-STD-883 qualification and extended temperature operation are required.
• Rugged Embedded Control — High logic density and extensive I/O support complex control, signal conditioning and interface tasks in rugged environments.
• High-Density I/O Systems — Suitable for designs needing large numbers of parallel or serial interfaces thanks to 574 available I/O pins.

Unique Advantages

• High Logic Integration: 146,124 logic elements enable consolidation of multiple functions into a single FPGA, reducing system complexity.
• Substantial On-Chip Memory: Approximately 5.12 Mbits of embedded RAM supports data handling and local buffering without adding external memory.
• Extensive I/O Count: 574 I/O pins provide flexibility for multi-channel interfacing and dense peripheral connectivity.
• Military Qualification: MIL-STD-883 qualification and military grade classification support use in certified, high-reliability designs.
• Wide Temperature Capability: −55 °C to 125 °C rating supports operation across harsh thermal environments.
• Compact High-Density Package: 1152-FCBGA (35 × 35) surface-mount package enables space-efficient board designs.

Why Choose M2GL150T-1FCG1152M?

The M2GL150T-1FCG1152M positions itself as a high-capacity, military-grade FPGA that combines a large number of logic elements, significant on-chip memory and a very high I/O count in a compact FCBGA package. Its MIL-STD-883 qualification and extended temperature range make it suitable for demanding, high-reliability embedded designs.

This device is well suited to designers and programs that need scalable logic resources, robust electrical and thermal performance, and the integration density to reduce board-level complexity and component count while meeting military qualification requirements.

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