M2GL150T-FC1152

The M2GL150T-FC1152 is an IGLOO2 family Field Programmable Gate Array (FPGA) IC from Microchip Technology. It combines a large logic fabric with embedded RAM and a high I/O count in a compact 1152-ball FCBGA package.

With 146,124 logic elements, approximately 5.12 Mbits of embedded memory and 574 I/Os, this device targets commercial applications that require substantial on-chip logic, memory and connectivity while fitting a surface-mount BGA footprint. It operates across a 1.14 V to 2.625 V supply range and a 0 °C to 85 °C temperature range.

Key Features

• Core Logic 146,124 logic elements provide high digital integration density for complex custom logic and programmable functions.
• Embedded Memory Approximately 5.12 Mbits of on-chip RAM to support buffering, state storage and local data handling without external memory.
• I/O Capacity 574 general-purpose I/Os to enable extensive interfacing and parallel connectivity with external devices and peripherals.
• Power Supply Flexibility Supports a voltage supply range from 1.14 V to 2.625 V, accommodating a range of core and I/O voltage schemes.
• Package & Mounting 1152-ball FCBGA (1152-BBGA) package, supplier device package 1152-FCBGA (35×35), designed for surface-mount PCB assembly.
• Commercial Temperature Grade Rated for operation from 0 °C to 85 °C, suitable for commercial-temperature applications.
• Environmental Compliance RoHS compliant for regulatory and manufacturing requirements.

Typical Applications

• Custom Logic and Glue Logic Implement complex, application-specific logic functions and interface glue without adding external ASICs.
• High-Density I/O Bridging Use the large I/O count for parallel data paths, protocol translation or multi-channel interfacing.
• Embedded Memory-Heavy Functions Take advantage of approximately 5.12 Mbits of on-chip RAM for buffering, packet handling or local data storage.

Unique Advantages

• High Logic Density: 146,124 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial On-Chip Memory: Approximately 5.12 Mbits of embedded RAM minimizes the need for external memory in many designs.
• Extensive Connectivity: 574 I/Os provide flexibility for interfacing, expansion and parallel I/O requirements.
• Compact BGA Package: 1152-FCBGA (35×35) packaging supports high pin count in a space-efficient surface-mount form factor.
• Design Flexibility: Wide supply voltage support (1.14 V–2.625 V) accommodates a variety of system voltage schemes.
• Regulatory Readiness: RoHS compliance supports environmentally conscious manufacturing and procurement.

Why Choose M2GL150T-FC1152?

The M2GL150T-FC1152 delivers a strong balance of logic capacity, embedded memory and I/O resources in a compact 1152-ball FCBGA package. Its specification set—146,124 logic elements, approximately 5.12 Mbits of on-chip RAM and 574 I/Os—makes it well suited to commercial designs that require dense programmable logic, significant local memory and broad connectivity while maintaining a surface-mount BGA footprint.

Rated for commercial temperature operation and RoHS compliant, the device is a practical choice for teams building high-density programmable solutions where integration and board-level consolidation are priorities.

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