M2GL150T-FC1152I

The M2GL150T-FC1152I is an IGLOO2 family FPGA from Microchip Technology, supplied in a 1152-ball FCBGA package. It provides a mid-to-large FPGA fabric with substantial I/O count and on-chip memory for industrial-grade embedded designs that require flexible, reconfigurable logic.

Key Features

• Logic Capacity — 146,124 logic elements available for implementing complex digital functions and custom hardware acceleration.
• Embedded Memory — Approximately 5.12 Mbits of on-chip RAM to support buffering, state storage, and data paths without external memory.
• I/O Density — 574 user I/Os to interface with sensors, peripherals, and external systems across multiple channels.
• Power Supply Range — Operates from 1.14 V to 2.625 V, enabling flexible integration with diverse system power rails.
• Package and Mounting — 1152-BBGA (1152-FCBGA, 35×35) surface-mount package for high-density PCB implementations.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C, suitable for many industrial environments.
• RoHS Compliant — Meets RoHS requirements for lead-free design and manufacturing processes.

Typical Applications

• Industrial Control — Leverages the industrial temperature rating, 146,124 logic elements, and 574 I/Os for real-time control, motor drives, and automation interfaces.
• Embedded Systems — Provides approximately 5.12 Mbits of embedded memory and a high I/O count for custom protocol bridging, data processing, and embedded compute subsystems.
• Communications and Networking — The combination of large logic capacity and numerous I/Os supports custom packet processing, interface conversion, and protocol offload tasks.
• High-Density PCB Designs — The 1152-FCBGA (35×35) package and surface-mount mounting enable compact board layouts with extensive connectivity.

Unique Advantages

• Large Programmable Fabric: 146,124 logic elements deliver substantial capacity for implementing complex custom logic and accelerators on a single device.
• Significant On-Chip Memory: Approximately 5.12 Mbits of embedded RAM reduces dependence on external memory and simplifies board-level design.
• High I/O Count: 574 I/Os provide flexibility to connect many peripherals, interfaces, and sensors without multiplexing compromises.
• Industrial-Grade Operation: Rated from −40 °C to 100 °C to support deployments in demanding temperature environments.
• Compact, High-Density Package: 1152-FCBGA (35×35) surface-mount package enables dense PCB integration while maintaining robust connectivity.

Why Choose M2GL150T-FC1152I?

The M2GL150T-FC1152I combines a large logic element count, considerable embedded memory, and a very high I/O complement in an industrial-grade FPGA package from Microchip Technology. This balance of capacity, connectivity, and temperature capability makes it suitable for engineers designing advanced embedded, control, and communication systems that require configurable hardware.

Designed for scalability and integration, the device supports designs that need on-chip memory and extensive interfacing while keeping board space compact with its 1152-ball FCBGA package. Its specified voltage and temperature ranges provide clear parameters for reliable system-level integration.

Request a quote or contact sales to discuss availability, lead times, and pricing for the M2GL150T-FC1152I.