M2GL150T-FCSG536I
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 293 5120000 146124 536-LFBGA, CSPBGA |
|---|---|
| Quantity | 1,054 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 536-CSPBGA (16x16) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 536-LFBGA, CSPBGA | Number of I/O | 293 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 146124 | Number of Logic Elements/Cells | 146124 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5120000 |
Overview of M2GL150T-FCSG536I – IGLOO2 FPGA, 146,124 logic elements, approximately 5.12 Mbits RAM, 293 I/O, 536-LFBGA
The M2GL150T-FCSG536I is an IGLOO2 Field Programmable Gate Array (FPGA) from Microchip Technology. It combines a high count of logic elements with embedded RAM and a large I/O complement in a compact BGA package.
Designed and specified for industrial-grade operation, this device delivers dense programmable logic, substantial on-chip memory, and broad I/O capability for embedded and industrial designs that require reconfigurable hardware and reliable operation across extended temperature ranges.
Key Features
- Logic Capacity 146,124 logic elements provide substantial programmable resource for complex logic, state machines and custom accelerators.
- Embedded Memory Approximately 5.12 Mbits of embedded memory support buffering, LUT-based storage and on-chip data handling without immediate need for external RAM.
- I/O 293 user I/O pins enable broad peripheral interfacing, multi‑channel connectivity and extensive signal routing directly to the device.
- Power Supply Range 1.14 V to 2.625 V supply range for core and I/O flexibility in mixed-voltage system designs.
- Package & Mounting 536-LFBGA package (supplier device package: 536-CSPBGA, 16×16) in a surface-mount form factor for dense board integration.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C, suitable for industrial environments requiring extended temperature performance.
- RoHS Compliant Meets RoHS requirements for materials compliance.
Typical Applications
- Industrial Control Systems Use the device's large logic capacity and wide operating temperature range to implement real-time control, I/O expansion and deterministic processing in industrial equipment.
- Embedded Systems Leverage substantial on-chip RAM and 293 I/O to consolidate glue logic, interface controllers and custom datapaths in compact embedded designs.
- Communications & Interface Bridging High I/O count and programmable logic enable protocol conversion, parallel-to-serial bridging and custom interface handling without large external logic stacks.
- Data Acquisition & Signal Conditioning On-chip memory and dense logic elements support buffering, preprocessing and deterministic signal handling close to sensors and front-end circuitry.
Unique Advantages
- Highly integrated logic density: 146,124 logic elements reduce the need for multiple discrete devices and simplify board-level design.
- Substantial embedded memory: Approximately 5.12 Mbits of on-chip RAM supports local buffering, state storage and data manipulation without immediate external memory.
- Extensive I/O capability: 293 I/O pins provide flexibility to connect multiple peripherals, sensors and high-channel-count interfaces directly to the FPGA.
- Flexible power options: The 1.14 V to 2.625 V supply range accommodates a variety of system voltage domains and design architectures.
- Industrial temperature rating: −40 °C to 100 °C operation enables deployment in temperature-challenging environments.
- Compact BGA package: 536-CSPBGA (16×16) surface-mount package allows high-density PCB implementations while preserving signal routing options.
Why Choose M2GL150T-FCSG536I?
The M2GL150T-FCSG536I positions itself as a robust option for designers who need significant programmable logic, ample embedded memory and a large number of I/O in an industrial-grade FPGA. Its combination of 146,124 logic elements, approximately 5.12 Mbits of embedded memory and 293 I/O in a compact 536-LFBGA package supports integration of complex functions while minimizing external components.
Backed by Microchip Technology's IGLOO2 family documentation, this device is suited for engineers building industrial and embedded systems that require reconfigurable logic, thermal resilience and a compact board footprint.
Request a quote today to check pricing and availability for the M2GL150T-FCSG536I. Submit your quotation request to receive detailed lead-time and purchasing information.

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