M2GL150TS-FC1152

The M2GL150TS-FC1152 is an IGLOO2 Field Programmable Gate Array (FPGA) offered in a 1,152-ball FCBGA package. Designed for commercial-grade embedded designs, it provides a large logic fabric and extensive I/O to support complex digital integration and system interfacing.

With 146,124 logic elements, approximately 5.12 Mbits of embedded memory and 574 I/O, this device targets designs that require high logic density, substantial on-chip memory, and broad external connectivity while operating within a 1.14 V to 2.625 V supply range.

Key Features

• Core Logic  IGLOO2 FPGA architecture offering 146,124 logic elements for implementing complex digital functions and custom logic.
• Embedded Memory  Approximately 5.12 Mbits of on-chip RAM to support buffering, state storage, and data processing without external memory in many use cases.
• I/O Capacity  574 general-purpose I/O pins to connect with a wide range of peripherals, interfaces and external devices.
• Power Supply  Wide supply range from 1.14 V to 2.625 V, allowing flexibility in system power architectures and interfacing levels.
• Package & Mounting  1152‑FCBGA (35×35) supplier device package in a surface-mount form factor for compact board-level integration.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C suitable for standard commercial applications.
• Environmental Compliance  RoHS compliant, meeting common environmental and materials requirements for commercial products.

Typical Applications

• High-density digital integration  Implement large, customized digital functions where ~146k logic elements enable consolidation of multiple subsystems into a single FPGA.
• I/O-rich interface bridging  Use the 574 I/O pins for protocol conversion, multi-interface aggregation, or board-level signal routing in mixed-signal systems.
• Embedded memory-dependent logic  Leverage approximately 5.12 Mbits of embedded RAM for buffering, packet handling, and stateful logic without immediate need for large external memories.
• Compact board-level designs  The 1152‑FCBGA (35×35) surface-mount package supports dense, space-constrained layouts while maintaining robust connectivity.

Unique Advantages

• Substantial logic capacity: 146,124 logic elements enable complex, high-function-count designs and reduce the need for multiple discrete devices.
• Generous on-chip memory: Approximately 5.12 Mbits of embedded RAM supports data buffering and local storage to simplify system memory architectures.
• Extensive I/O availability: 574 I/O pins provide flexible connectivity for sensors, transceivers, and peripheral interfaces.
• Flexible supply range: 1.14 V to 2.625 V operation accommodates a variety of logic-level domains and power-rail configurations.
• Board-level integration: 1152‑FCBGA (35×35) surface-mount package balances pin count and compact footprint for dense PCB designs.
• Commercial readiness and compliance: Commercial grade operation (0 °C to 85 °C) and RoHS compliance simplify qualification for mainstream products.

Why Choose M2GL150TS-FC1152?

The M2GL150TS-FC1152 positions itself as a high-capacity, I/O-rich FPGA option for commercial embedded systems that require substantial configurable logic and on-chip memory. Its combination of 146,124 logic elements, approximately 5.12 Mbits of RAM and 574 I/O pins enables consolidation of complex functions and flexible interfacing within a single device.

Engineers and product teams developing space-conscious, connectivity-heavy designs will find the 1152‑FCBGA package and wide supply range useful for integrating this FPGA into diverse board-level architectures. RoHS compliance and a commercial operating range further align the device with standard product development and manufacturing flows.

Request a quote or submit a pricing inquiry today to evaluate the M2GL150TS-FC1152 for your next commercial FPGA design project.