M2GL150TS-1FCV484I
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 248 5120000 146124 484-BFBGA |
|---|---|
| Quantity | 980 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (19x19) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BFBGA | Number of I/O | 248 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 146124 | Number of Logic Elements/Cells | 146124 | ||
| Number of Gates | N/A | ECCN | 3A991B2 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5120000 |
Overview of M2GL150TS-1FCV484I – IGLOO2 Field Programmable Gate Array (FPGA) IC 248 5120000 146124 484-BFBGA
The M2GL150TS-1FCV484I is an IGLOO2 field programmable gate array (FPGA) from Microchip Technology, offered in a compact 484‑BFBGA package. It provides a high logic density with extensive embedded memory and a broad I/O count suitable for industrial-grade designs.
With approximately 146,124 logic elements and roughly 5.12 Mbits of embedded RAM, this device targets applications that require substantial programmable logic, significant on-chip memory and flexible I/O while operating across a wide voltage and temperature range.
Key Features
- Core Logic Approximately 146,124 logic elements to implement complex digital functions and custom logic architectures.
- Embedded Memory Approximately 5.12 Mbits of on-chip RAM to support data buffering, state storage and local memory needs without external DRAM.
- I/O Capacity 248 programmable I/O pins to interface with a variety of peripherals, sensors and external devices.
- Power Operates across a supply voltage range of 1.14 V to 2.625 V, allowing flexibility in system power-rail design.
- Package & Mounting 484‑BFBGA package (supplier package: 484‑FBGA, 19×19) in a surface-mount form factor for compact board designs.
- Temperature Range Industrial operating range from −40 °C to 100 °C for deployment in temperature-challenged environments.
- Compliance RoHS compliant.
Typical Applications
- Industrial Control and Automation Implement programmable logic and local memory for control algorithms, communication bridging and I/O aggregation in industrial systems.
- Embedded Systems and SoC Integration Provide custom logic acceleration and on-chip memory for embedded platforms requiring high logic density and integrated resources.
- High‑Density I/O Systems Support designs that need many signal interfaces with 248 I/O pins in a compact BFBGA footprint.
- Rugged Electronics Suitable for temperature-sensitive deployments with an industrial −40 °C to 100 °C operating range.
Unique Advantages
- High Logic Density: Approximately 146,124 logic elements enable complex designs and large-scale custom logic implementation without excessive external components.
- Substantial On‑Chip Memory: Roughly 5.12 Mbits of embedded RAM reduces dependence on external memory, simplifying BOM and layout.
- Generous I/O Count: 248 I/O pins provide flexibility for multiple interfaces, sensors and peripheral connections.
- Wide Voltage Support: A supply range from 1.14 V to 2.625 V offers adaptability to different power architectures.
- Industrial Temperature Rating: Rated for −40 °C to 100 °C operation to meet the demands of industrial deployments.
- Compact Surface‑Mount BFBGA Package: 484‑BFBGA (484‑FBGA, 19×19) delivers high integration density in a board-friendly surface‑mount form factor.
Why Choose M2GL150TS-1FCV484I?
The M2GL150TS-1FCV484I combines high logic element count, substantial embedded memory and a large I/O complement in a compact industrial-grade package, positioning it for designs that require on-chip capacity and reliable operation across a wide temperature range. Its supply voltage flexibility and surface-mount 484‑BFBGA footprint help simplify system integration and board layout.
Backed by Microchip Technology’s IGLOO2 family, this FPGA is suited to engineers and procurement teams looking for a scalable, memory-rich programmable-logic device for industrial and embedded applications where integration density and temperature robustness matter.
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