M2GL150TS-1FCS536I

IC FPGA 293 I/O 536CSPBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 293 5120000 146124 536-LFBGA, CSPBGA

Quantity 724 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package536-CSPBGA (16x16)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case536-LFBGA, CSPBGANumber of I/O293Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs146124Number of Logic Elements/Cells146124
Number of GatesN/AECCN3A991B2HTS Code8542.39.0001
QualificationN/ATotal RAM Bits5120000

Overview of M2GL150TS-1FCS536I – IGLOO2 FPGA, 146,124 Logic Elements, 536‑LFBGA

The M2GL150TS-1FCS536I is an IGLOO2 field programmable gate array (FPGA) designed for industrial applications that require substantial logic density and flexible I/O. It integrates 146,124 logic elements with approximately 5.12 Mbits of on-chip RAM and provides 293 general-purpose I/Os in a 536‑LFBGA (536‑CSPBGA, 16×16) package.

With a wide supply voltage range and an industrial operating temperature, this device is suitable for designs that demand reprogrammable logic capacity, high I/O counts, and board-level surface-mount assembly.

Key Features

  • Logic Capacity  146,124 logic elements for implementing complex digital functions and custom hardware acceleration.
  • Embedded Memory  Approximately 5.12 Mbits of on-chip RAM to support buffering, state machines, and local data storage without external memory.
  • I/O Density  293 I/Os to accommodate wide bus interfaces, multiple peripherals, and high pin-count designs.
  • Power Supply Flexibility  Operates across a 1.14 V to 2.625 V supply range to support a variety of board power architectures.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet demanding environmental requirements.
  • Package and Mounting  536‑LFBGA (536‑CSPBGA, 16×16) surface-mount package for compact, high-density PCB layouts.
  • RoHS Compliance  RoHS compliant for regulatory and environmental considerations.

Unique Advantages

  • High Logic Density: 146,124 logic elements provide the capacity to consolidate multiple functions into a single programmable device, reducing board-level complexity.
  • Significant On‑Chip Memory: Approximately 5.12 Mbits of embedded RAM simplifies design by enabling local data storage and buffering without immediate reliance on external memories.
  • Extensive I/O Count: 293 I/Os support broad interfacing options for sensors, peripherals, and parallel/serial buses.
  • Industrial Reliability: Specified for −40 °C to 100 °C operation, supporting deployments in temperature-challenging environments.
  • Flexible Power Integration: 1.14 V to 2.625 V supply range allows adaptation to a range of system power domains.
  • Compact BGA Packaging: 536‑CSPBGA (16×16) footprint enables high-density board designs while remaining surface-mount friendly.

Why Choose M2GL150TS-1FCS536I?

The M2GL150TS-1FCS536I positions itself as a versatile, high‑capacity IGLOO2 FPGA option for engineers needing substantial programmable logic, embedded RAM, and high I/O counts in an industrial-grade package. Its combination of logic elements, memory, and I/O capability supports consolidation of complex digital functions and flexible system interfacing.

This device is suited to design teams focused on robust, scalable hardware implementations that require on-chip resources and wide operating conditions. The compact 536‑LFBGA package and surface-mount mounting make it practical for space-constrained PCBs while retaining the reprogrammability inherent to FPGA-based solutions.

Request a quote or submit a product inquiry to receive pricing and availability information for the M2GL150TS-1FCS536I.

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