M2GL150TS-1FCG1152I
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 574 5120000 146124 1152-BBGA, FCBGA |
|---|---|
| Quantity | 805 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 574 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 146124 | Number of Logic Elements/Cells | 146124 | ||
| Number of Gates | N/A | ECCN | 5A002A1 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5120000 |
Overview of M2GL150TS-1FCG1152I – IGLOO2 Field Programmable Gate Array (FPGA) IC 574 I/Os, ~5.12 Mbits RAM, 146,124 Logic Elements, 1152-FCBGA
The M2GL150TS-1FCG1152I is an IGLOO2 FPGA from Microchip Technology designed for industrial applications requiring high logic density and a large I/O count. This surface-mount device integrates 146,124 logic elements, approximately 5.12 Mbits of embedded memory and 574 user I/Os in a 1152-FCBGA (35×35) package.
With a wide supply voltage range (1.14 V to 2.625 V), industrial-grade qualification and an operating range from −40 °C to 100 °C, the device is suited to designs that demand robust operation across temperature and flexible power domains.
Key Features
- Logic Capacity 146,124 logic elements to implement complex combinational and sequential designs.
- Embedded Memory Approximately 5.12 Mbits of on-chip RAM for buffering, LUT-based memory structures and intermediate data storage.
- High I/O Count 574 user I/Os support wide parallel interfaces, high-pin-count connectivity and board-level routing flexibility.
- Power and Voltage Flexibility Operates across a 1.14 V to 2.625 V supply range to accommodate different I/O and core voltage domains.
- Package and Mounting 1152-FCBGA (35×35) package in a surface-mount form factor for compact, high-density board layouts.
- Industrial Temperature Range Rated for −40 °C to 100 °C operation for deployment in industrial environments.
- RoHS Compliant Meets RoHS environmental requirements for lead-free assembly.
Typical Applications
- Industrial Control Use in control systems where industrial-grade temperature range and a high I/O count are required for sensor, actuator and bus interfacing.
- High-Density Logic Implementation Deploy as a compact, programmable logic engine for designs that require substantial logic capacity and embedded memory.
- Prototyping and System Integration Suitable for development and integration tasks that need many I/Os and flexible voltage domains in a single package.
Unique Advantages
- Significant Logic Density: 146,124 logic elements enable implementation of sizeable custom logic and control functions on a single device.
- Substantial On‑Chip Memory: Approximately 5.12 Mbits of embedded RAM reduces dependency on external memory for many buffering and state-storage tasks.
- Extensive I/O Capability: 574 user I/Os provide direct interfacing to multiple peripherals and bus standards without added interface chips.
- Industrial Robustness: Industrial grade rating and −40 °C to 100 °C operating range support deployment in demanding environments.
- Flexible Power Options: Broad supply voltage support (1.14 V–2.625 V) allows designers to align the FPGA to varied power architectures.
- Compact High‑Pin Package: 1152-FCBGA (35×35) delivers high pin-count in a compact surface-mount footprint for space-constrained boards.
Why Choose M2GL150TS-1FCG1152I?
This IGLOO2 FPGA balances high logic and memory resources with a large I/O complement and industrial-grade specifications, making it a strong candidate for engineers building robust, compact systems. Its combination of capacity, I/O density and temperature rating aligns with designs that require on-board programmability and reliable operation across a wide range of conditions.
For teams focused on scalable, long-lived designs, the M2GL150TS-1FCG1152I offers a versatile platform that reduces the need for multiple discrete components while providing clear electrical and mechanical characteristics for predictable integration.
Request a quote or submit a procurement inquiry to receive pricing and availability for the M2GL150TS-1FCG1152I.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D