M2GL150TS-1FC1152
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 574 5120000 146124 1152-BBGA, FCBGA |
|---|---|
| Quantity | 1,175 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 10 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 574 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 146124 | Number of Logic Elements/Cells | 146124 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 5120000 |
Overview of M2GL150TS-1FC1152 – IGLOO2 FPGA, 1152-FCBGA
The M2GL150TS-1FC1152 is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for commercial-grade programmable logic applications. It combines a large logic fabric with substantial embedded memory and high I/O density in a compact 1152-FCBGA surface-mount package.
Suitable for designs that require significant on-chip resources within a commercial temperature range, this device provides a balance of integration and flexibility for embedded systems and high-density I/O implementations.
Key Features
- Logic Capacity Provides 146,124 logic elements to implement complex logic functions and custom hardware accelerators.
- Embedded Memory Contains approximately 5.12 Mbits of on-chip RAM for buffering, state storage, and memory-mapped logic requirements.
- High I/O Count Features 574 I/O pins to support dense peripheral integration and wide parallel interfaces.
- Power Supply Range Operates from 1.14 V to 2.625 V, enabling flexible power domain integration in system designs.
- Package and Mounting Available in a 1152-FCBGA (35×35) package with surface-mount mounting for compact board-level implementation.
- Commercial Temperature Grade Rated for operation from 0 °C to 85 °C to meet typical commercial application environments.
- RoHS Compliant Meets RoHS environmental requirements for lead-free assembly.
Typical Applications
- Embedded Systems Integration of custom logic and control functions where a high count of logic elements and embedded memory are required.
- I/O-Intensive Interfaces Boards and modules that require large numbers of general-purpose or parallel interfaces can leverage the 574 I/O pins for connectivity.
- Memory-Centric Logic Applications that need on-chip buffering or state storage can use the approximately 5.12 Mbits of embedded RAM to reduce external memory dependence.
Unique Advantages
- High Logic Density: 146,124 logic elements enable implementation of complex and sizeable logic designs without immediate partitioning across devices.
- Substantial Embedded Memory: Approximately 5.12 Mbits of on-chip RAM supports larger data storage and local buffering to simplify system memory architecture.
- Extensive I/O Resources: 574 I/O pins provide the ability to connect many peripherals or wide parallel buses directly to the FPGA fabric.
- Compact High-Pin-Count Package: The 1152-FCBGA (35×35) package delivers high pin count in a space-efficient, surface-mount form factor for dense PCB designs.
- Flexible Power Integration: A supply range from 1.14 V to 2.625 V allows compatibility with different system power rails and domain configurations.
- Commercial Temperature Rating: Rated 0 °C to 85 °C to align with commercial product deployment requirements.
Why Choose M2GL150TS-1FC1152?
The M2GL150TS-1FC1152 combines a large logic fabric, substantial embedded memory, and a high number of I/O in a compact 1152-FCBGA package, offering a highly integrated solution for commercial FPGA applications. Backed by Microchip Technology, it provides a clear footprint for designs that need on-chip resources and dense connectivity while operating within a standard commercial temperature range.
This device is well suited for engineering teams building embedded systems, I/O-heavy modules, or memory-dense logic functions who require a single-chip solution to reduce board-level complexity and streamline BOM. Its combination of logic capacity, memory, and I/O density delivers scalable capability for a range of commercial designs.
Request a quote or submit an inquiry today to learn about availability and pricing for the M2GL150TS-1FC1152.

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