M2GL150TS-1FC1152

IC FPGA 574 I/O 1152FCBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 574 5120000 146124 1152-BBGA, FCBGA

Quantity 1,175 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time10 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1152-BBGA, FCBGANumber of I/O574Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs146124Number of Logic Elements/Cells146124
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5120000

Overview of M2GL150TS-1FC1152 – IGLOO2 FPGA, 1152-FCBGA

The M2GL150TS-1FC1152 is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for commercial-grade programmable logic applications. It combines a large logic fabric with substantial embedded memory and high I/O density in a compact 1152-FCBGA surface-mount package.

Suitable for designs that require significant on-chip resources within a commercial temperature range, this device provides a balance of integration and flexibility for embedded systems and high-density I/O implementations.

Key Features

  • Logic Capacity  Provides 146,124 logic elements to implement complex logic functions and custom hardware accelerators.
  • Embedded Memory  Contains approximately 5.12 Mbits of on-chip RAM for buffering, state storage, and memory-mapped logic requirements.
  • High I/O Count  Features 574 I/O pins to support dense peripheral integration and wide parallel interfaces.
  • Power Supply Range  Operates from 1.14 V to 2.625 V, enabling flexible power domain integration in system designs.
  • Package and Mounting  Available in a 1152-FCBGA (35×35) package with surface-mount mounting for compact board-level implementation.
  • Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C to meet typical commercial application environments.
  • RoHS Compliant  Meets RoHS environmental requirements for lead-free assembly.

Typical Applications

  • Embedded Systems  Integration of custom logic and control functions where a high count of logic elements and embedded memory are required.
  • I/O-Intensive Interfaces  Boards and modules that require large numbers of general-purpose or parallel interfaces can leverage the 574 I/O pins for connectivity.
  • Memory-Centric Logic  Applications that need on-chip buffering or state storage can use the approximately 5.12 Mbits of embedded RAM to reduce external memory dependence.

Unique Advantages

  • High Logic Density: 146,124 logic elements enable implementation of complex and sizeable logic designs without immediate partitioning across devices.
  • Substantial Embedded Memory: Approximately 5.12 Mbits of on-chip RAM supports larger data storage and local buffering to simplify system memory architecture.
  • Extensive I/O Resources: 574 I/O pins provide the ability to connect many peripherals or wide parallel buses directly to the FPGA fabric.
  • Compact High-Pin-Count Package: The 1152-FCBGA (35×35) package delivers high pin count in a space-efficient, surface-mount form factor for dense PCB designs.
  • Flexible Power Integration: A supply range from 1.14 V to 2.625 V allows compatibility with different system power rails and domain configurations.
  • Commercial Temperature Rating: Rated 0 °C to 85 °C to align with commercial product deployment requirements.

Why Choose M2GL150TS-1FC1152?

The M2GL150TS-1FC1152 combines a large logic fabric, substantial embedded memory, and a high number of I/O in a compact 1152-FCBGA package, offering a highly integrated solution for commercial FPGA applications. Backed by Microchip Technology, it provides a clear footprint for designs that need on-chip resources and dense connectivity while operating within a standard commercial temperature range.

This device is well suited for engineering teams building embedded systems, I/O-heavy modules, or memory-dense logic functions who require a single-chip solution to reduce board-level complexity and streamline BOM. Its combination of logic capacity, memory, and I/O density delivers scalable capability for a range of commercial designs.

Request a quote or submit an inquiry today to learn about availability and pricing for the M2GL150TS-1FC1152.

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