M2GL150TS-1FC1152M

The M2GL150TS-1FC1152M is an IGLOO2 Field Programmable Gate Array (FPGA) IC from Microchip Technology, packaged in a 1152‑ball FCBGA (35×35) surface‑mount package. This military‑grade FPGA combines a large logic capacity with substantial embedded RAM and a high I/O count to address rugged embedded and defense applications that require MIL‑STD‑883 qualification and extended operating temperature range.

With 146,124 logic elements, approximately 5.12 Mbits of on‑chip RAM and 574 I/O, the device is intended where integration, deterministic I/O density and military qualification are primary design drivers.

Key Features

• Logic Capacity  146,124 logic elements provide abundant programmable fabric for complex designs and custom logic implementations.
• Embedded Memory  Approximately 5.12 Mbits of on‑chip RAM to support buffering, state storage and intermediate processing within the FPGA fabric.
• I/O Density  574 user I/O pins for broad connectivity options to peripherals, sensors and external interfaces.
• Package and Mounting  1152‑FCBGA (35×35) 1152‑BBGA package in a surface‑mount form factor for compact board integration.
• Power Supply Range  Operates from 1.14 V to 2.625 V, providing flexibility for different power architectures.
• Military Qualification  Qualified to MIL‑STD‑883 and specified as Military grade, supporting applications that require stringent component assurance.
• Extended Temperature Range  Rated for operation from −55 °C to 125 °C, enabling deployment in temperature‑extreme environments.
• Environmental Compliance  RoHS compliant for alignment with regulatory and assembly requirements.

Typical Applications

• Defense Electronics  Integration in military command, control and communications equipment where MIL‑STD‑883 qualification and extended temperature tolerance are required.
• Rugged Embedded Systems  Use in mission‑critical embedded controllers and processing modules that need high logic density and significant on‑chip memory.
• High‑Density I/O Interfaces  Implementing custom I/O aggregation, protocol bridging or sensor interface logic that leverages the 574 available I/O pins.

Unique Advantages

• High Logic Integration: 146,124 logic elements allow complex custom logic and sizable FPGA designs to be implemented on a single device.
• Substantial On‑Chip Memory: Approximately 5.12 Mbits of embedded RAM reduces external memory dependency and shortens signal paths for faster local data handling.
• Large I/O Count: 574 I/O pins provide flexibility for multi‑channel interfaces and dense peripheral connectivity without external multiplexing.
• Military‑Grade Qualification: MIL‑STD‑883 qualification and specified military grade support use in applications with stringent reliability and traceability requirements.
• Wide Operating Conditions: −55 °C to 125 °C temperature rating and a 1.14 V–2.625 V supply range enable deployment across diverse environmental and power conditions.
• Compact FCBGA Package: 1152‑FCBGA (35×35) packaging provides a high‑density solution for space‑constrained PCBs.

Why Choose M2GL150TS-1FC1152M?

The M2GL150TS-1FC1152M positions itself as a military‑qualified IGLOO2 FPGA that balances high logic capacity, significant embedded memory and extensive I/O in a compact FCBGA package. Its MIL‑STD‑883 qualification and −55 °C to 125 °C operating range make it appropriate for engineers designing rugged, mission‑critical systems that require verified component reliability.

Designed for applications where integration, deterministic I/O and thermal robustness are important, this Microchip Technology device offers a scalable hardware foundation for complex programmable logic tasks in defense and rugged embedded environments.

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