M2GL150TS-1FCG1152M
| Part Description |
IGLOO2 Field Programmable Gate Array (FPGA) IC 574 5120000 146124 1152-BBGA, FCBGA |
|---|---|
| Quantity | 540 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FCBGA (35x35) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA | Number of I/O | 574 | Voltage | 1.14 V - 2.625 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 146124 | Number of Logic Elements/Cells | 146124 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | MIL-STD-883 | Total RAM Bits | 5120000 |
Overview of M2GL150TS-1FCG1152M – IGLOO2 Field Programmable Gate Array (FPGA) IC
The M2GL150TS-1FCG1152M is an IGLOO2 family FPGA from Microchip Technology designed for military-grade embedded applications. It integrates high logic capacity, substantial on-chip memory and a large I/O count in a compact 1152-FCBGA (35×35) surface-mount package.
Engineered and qualified to MIL-STD-883 with an operating range of –55 °C to 125 °C and a supply voltage window of 1.14 V to 2.625 V, this device is tailored for rugged systems that require qualified components with dense logic and I/O resources.
Key Features
- Core Logic — 146,124 logic elements provide a high-capacity fabric for complex programmable logic and custom digital functions.
- Embedded Memory — Approximately 5.12 Mbits of on-chip RAM to support buffers, FIFOs and intermediate data storage without external memory.
- I/O Density — 574 general-purpose I/O pins to interface with sensors, transceivers, high-speed peripherals and wide bus architectures.
- Power and Supply — Operates across a broad supply range from 1.14 V to 2.625 V to accommodate varied system power domains.
- Package and Mounting — 1152-FCBGA (35×35) package with surface-mount construction for compact board-level integration.
- Qualification and Temperature — Military grade with MIL-STD-883 qualification and an operating temperature range of –55 °C to 125 °C for harsh environments.
Typical Applications
- Military and Defense Systems — Use as a qualified programmable logic element in fielded defense electronics that require MIL-STD-883 components and extended temperature operation.
- Avionics and Rugged Embedded Platforms — High logic density and extensive I/O support control, signal conditioning and custom processing tasks in avionics subsystems.
- Secure Communications and Networking — Implement protocol handling, packet processing and custom encrypt/decrypt logic leveraging on-chip memory and abundant logic elements.
- High-Density I/O Control — Drive large sensor arrays, actuator networks or multi-channel data acquisition systems using 574 available I/O pins.
Unique Advantages
- High Logic Capacity: 146,124 logic elements enable implementation of complex digital designs without external logic expansion.
- Substantial On-Chip Memory: Approximately 5.12 Mbits of embedded RAM reduce reliance on external memory and simplify board design.
- Extensive I/O: 574 I/O pins support broad interfacing options and multi-channel system integration.
- Military Qualification: MIL-STD-883 qualification and military grade classification provide confidence for defense and ruggedized deployments.
- Wide Temperature Range: Operation from –55 °C to 125 °C meets the thermal demands of harsh-environment applications.
- Flexible Supply Range: 1.14 V to 2.625 V support for diverse system power architectures and voltage domains.
Why Choose M2GL150TS-1FCG1152M?
The M2GL150TS-1FCG1152M positions itself as a high-capacity, military-qualified FPGA option for designs that require dense logic, significant embedded memory and a large number of I/Os in a compact FCBGA package. Its MIL-STD-883 qualification and extended operating temperature range make it suitable for rugged and defense-oriented systems.
This device is well suited for designers building complex, long-lived embedded systems that need scalability in logic and memory resources while meeting military qualification and thermal requirements. Its combination of features supports integration of sophisticated processing, interface and control functions on a single programmable device.
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