M2GL150TS-1FCG1152M

IC FPGA 574 I/O 1152FCBGA
Part Description

IGLOO2 Field Programmable Gate Array (FPGA) IC 574 5120000 146124 1152-BBGA, FCBGA

Quantity 540 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1152-FCBGA (35x35)GradeMilitaryOperating Temperature-55°C – 125°C
Package / Case1152-BBGA, FCBGANumber of I/O574Voltage1.14 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs146124Number of Logic Elements/Cells146124
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationMIL-STD-883Total RAM Bits5120000

Overview of M2GL150TS-1FCG1152M – IGLOO2 Field Programmable Gate Array (FPGA) IC

The M2GL150TS-1FCG1152M is an IGLOO2 family FPGA from Microchip Technology designed for military-grade embedded applications. It integrates high logic capacity, substantial on-chip memory and a large I/O count in a compact 1152-FCBGA (35×35) surface-mount package.

Engineered and qualified to MIL-STD-883 with an operating range of –55 °C to 125 °C and a supply voltage window of 1.14 V to 2.625 V, this device is tailored for rugged systems that require qualified components with dense logic and I/O resources.

Key Features

  • Core Logic — 146,124 logic elements provide a high-capacity fabric for complex programmable logic and custom digital functions.
  • Embedded Memory — Approximately 5.12 Mbits of on-chip RAM to support buffers, FIFOs and intermediate data storage without external memory.
  • I/O Density — 574 general-purpose I/O pins to interface with sensors, transceivers, high-speed peripherals and wide bus architectures.
  • Power and Supply — Operates across a broad supply range from 1.14 V to 2.625 V to accommodate varied system power domains.
  • Package and Mounting — 1152-FCBGA (35×35) package with surface-mount construction for compact board-level integration.
  • Qualification and Temperature — Military grade with MIL-STD-883 qualification and an operating temperature range of –55 °C to 125 °C for harsh environments.

Typical Applications

  • Military and Defense Systems — Use as a qualified programmable logic element in fielded defense electronics that require MIL-STD-883 components and extended temperature operation.
  • Avionics and Rugged Embedded Platforms — High logic density and extensive I/O support control, signal conditioning and custom processing tasks in avionics subsystems.
  • Secure Communications and Networking — Implement protocol handling, packet processing and custom encrypt/decrypt logic leveraging on-chip memory and abundant logic elements.
  • High-Density I/O Control — Drive large sensor arrays, actuator networks or multi-channel data acquisition systems using 574 available I/O pins.

Unique Advantages

  • High Logic Capacity: 146,124 logic elements enable implementation of complex digital designs without external logic expansion.
  • Substantial On-Chip Memory: Approximately 5.12 Mbits of embedded RAM reduce reliance on external memory and simplify board design.
  • Extensive I/O: 574 I/O pins support broad interfacing options and multi-channel system integration.
  • Military Qualification: MIL-STD-883 qualification and military grade classification provide confidence for defense and ruggedized deployments.
  • Wide Temperature Range: Operation from –55 °C to 125 °C meets the thermal demands of harsh-environment applications.
  • Flexible Supply Range: 1.14 V to 2.625 V support for diverse system power architectures and voltage domains.

Why Choose M2GL150TS-1FCG1152M?

The M2GL150TS-1FCG1152M positions itself as a high-capacity, military-qualified FPGA option for designs that require dense logic, significant embedded memory and a large number of I/Os in a compact FCBGA package. Its MIL-STD-883 qualification and extended operating temperature range make it suitable for rugged and defense-oriented systems.

This device is well suited for designers building complex, long-lived embedded systems that need scalability in logic and memory resources while meeting military qualification and thermal requirements. Its combination of features supports integration of sophisticated processing, interface and control functions on a single programmable device.

Request a quote or submit an inquiry to obtain pricing, lead times and availability for the M2GL150TS-1FCG1152M.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up