M7A3P1000-FG256I

The M7A3P1000-FG256I is a ProASIC3 family Field Programmable Gate Array (FPGA) from Microchip Technology designed for industrial embedded designs. It provides a mid-density programmable fabric with 24,576 logic elements, approximately 0.147 Mbits of embedded memory, and 177 user I/O pins in a 256-LBGA package.

With a 1.425 V to 1.575 V core supply window and an operating temperature range of −40 °C to 100 °C, this device targets industrial applications that require reliable, reprogrammable logic and flexible I/O in a compact surface-mount package.

Key Features

• Core Architecture  ProASIC3 family FPGA fabric providing 24,576 logic elements suitable for mid-density programmable logic functions.
• Logic Capacity  Approximately 1,000,000 gates and 24,576 logic elements to implement combinational and sequential logic, state machines, and custom interfacing.
• Embedded Memory  Approximately 0.147 Mbits of on-chip RAM for small buffers, FIFOs, and local storage.
• I/O  177 user I/O pins to support multi‑signal interfaces and board-level connectivity in dense designs.
• Power Supply  Core supply range from 1.425 V to 1.575 V for stable FPGA operation within specified limits.
• Package & Mounting  256-LBGA (supplier designation: 256-FPBGA, 17 × 17) surface-mount package for compact board integration and high pin density.
• Industrial Temperature Grade  Qualified for operation from −40 °C to 100 °C for deployment in industrial environments.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control  Use as programmable logic and I/O aggregation in controllers and automation systems where the −40 °C to 100 °C range and industrial grade are required.
• Embedded Processing & Glue Logic  Implement custom interfacing, protocol translation, and glue logic using the device’s 24,576 logic elements and 177 I/Os.
• Communication Interfaces  Provide protocol adapters and parallel/serial I/O handling where moderate on‑chip memory and abundant I/O pins are needed.
• Instrumentation & Test Equipment  Integrate control logic and data routing in compact, surface-mount assemblies leveraging the 256-LBGA package.

Unique Advantages

• Mid-density programmable fabric: 24,576 logic elements deliver substantial logic resources for complex state machines and custom logic without the overhead of larger devices.
• Ample I/O count: 177 user I/Os enable multiple parallel interfaces and flexible board-level connectivity.
• Industrial temperature capability: Rated from −40 °C to 100 °C to meet environmental demands of industrial deployments.
• Compact, high-density package: 256-LBGA (17 × 17) surface-mount package balances pin count and board area for space-constrained designs.
• Deterministic power range: Narrow core supply window (1.425 V–1.575 V) simplifies power-rail design and regulation for the FPGA core.
• RoHS compliant: Conforms to lead-free manufacturing requirements for modern electronics production.

Why Choose M7A3P1000-FG256I?

The M7A3P1000-FG256I positions itself as a practical mid-density FPGA choice for industrial embedded systems that require a balance of logic resources, I/O count, and a compact, surface-mount package. Its 24,576 logic elements, approximately 0.147 Mbits of embedded memory, and 177 I/Os make it suitable for designs that need reprogrammable logic, local buffering, and substantial I/O connectivity within industrial temperature limits.

This device is well suited to engineers and procurement teams seeking a RoHS-compliant, industrial-grade FPGA from the ProASIC3 family with a focused set of on-chip resources and a high-density 256-LBGA footprint.

Request a quote or submit an inquiry to obtain pricing and availability for the M7A3P1000-FG256I. Our team can provide procurement and ordering details to support your design schedule.