M7A3P1000-FGG144

The M7A3P1000-FGG144 is a ProASIC3 field programmable gate array (FPGA) IC designed for programmable logic integration. It provides 24,576 logic elements, approximately 0.147 Mbits of embedded memory, and 97 general-purpose I/O pins in a 144-LBGA package.

With a 1.425 V to 1.575 V core supply range and commercial-grade operation from 0 °C to 85 °C, this surface-mount device suits a wide range of configurable digital designs that require on-chip logic, memory, and moderate I/O density.

Key Features

• Core Logic — 24,576 logic elements provide substantial capacity for implementing complex combinational and sequential logic functions.
• On-chip Memory — Approximately 0.147 Mbits (147,456 bits) of embedded RAM for data buffering, state storage, and small lookup tables.
• I/O — 97 user I/O pins available for interfacing with external peripherals, sensors, and logic domains.
• Gate Count — 1,000,000 gates for estimating overall design capacity and integration potential.
• Power — Core supply range of 1.425 V to 1.575 V for stable operation within specified voltage window.
• Package & Mounting — 144-LBGA (supplier package: 144-FPBGA 13×13) in a surface-mount format for compact board integration.
• Commercial Temperature Grade — Rated for 0 °C to 85 °C operation, suitable for commercially deployed electronic products.
• RoHS Compliant — Meets RoHS environmental compliance requirements.

Typical Applications

• Custom Logic and Glue Logic — Implement interface bridging and protocol adaptation using the device’s 24,576 logic elements and 97 I/Os to reduce discrete component count.
• Control and Sequencing — Use embedded RAM and logic resources to implement deterministic control state machines and sequencing logic in embedded systems.
• Prototyping and Evaluation — Deploy as a reprogrammable platform for validating digital designs and proof-of-concept implementations before finalizing ASIC designs.

Unique Advantages

• Substantial Logic Capacity: 24,576 logic elements enable integration of multiple functions on a single device, simplifying board-level design.
• Embedded Memory: Approximately 0.147 Mbits of on-chip RAM supports local buffering and state retention without external memory.
• Generous I/O Count: 97 I/Os provide flexibility for interfacing with sensors, peripherals, and parallel buses.
• Compact Package: 144-LBGA (13×13 FPBGA) keeps board footprint small while supporting surface-mount assembly processes.
• Commercial Temperature Rating: Rated 0 °C to 85 °C for deployment in standard commercial electronic products.
• Environmental Compliance: RoHS compliance supports environmentally conscious designs and regulatory requirements.

Why Choose M7A3P1000-FGG144?

The M7A3P1000-FGG144 positions itself as a capable, commercially rated ProASIC3 FPGA option for designers needing a balance of logic density, on-chip memory, and I/O in a compact LBGA package. Its combination of 24,576 logic elements, approximately 0.147 Mbits of embedded RAM, and 97 I/Os supports consolidation of multiple digital functions and reduces external component count.

This device is well suited for engineers and teams developing configurable digital systems, control logic, and prototype platforms who require predictable operating voltage and temperature ranges along with RoHS compliance.

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